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  1. # dmidecode 3.5
  2. Getting SMBIOS data from sysfs.
  3. SMBIOS 3.2.0 present.
  4. Table at 0xCB70A000.
  5.  
  6. Handle 0x0000, DMI type 0, 26 bytes
  7. BIOS Information
  8. Vendor: HUAWEI
  9. Version: 2.06
  10. Release Date: 02/17/2023
  11. Address: 0xE0000
  12. Runtime Size: 128 kB
  13. ROM Size: 16 MB
  14. Characteristics:
  15. PCI is supported
  16. PNP is supported
  17. BIOS is upgradeable
  18. BIOS shadowing is allowed
  19. Boot from CD is supported
  20. Selectable boot is supported
  21. EDD is supported
  22. ACPI is supported
  23. USB legacy is supported
  24. Smart battery is supported
  25. BIOS boot specification is supported
  26. Targeted content distribution is supported
  27. UEFI is supported
  28. BIOS Revision: 2.6
  29. Firmware Revision: 2.6
  30.  
  31. Handle 0x0001, DMI type 1, 27 bytes
  32. System Information
  33. Manufacturer: HUAWEI
  34. Product Name: KLVL-WXX9
  35. Version: M1010
  36. Serial Number: YAVBB21912801037
  37. UUID: 20210914-9408-5333-14a7-9408533314a8
  38. Wake-up Type: Power Switch
  39. SKU Number: C100
  40. Family: MateBook 14
  41.  
  42. Handle 0x0002, DMI type 2, 17 bytes
  43. Base Board Information
  44. Manufacturer: HUAWEI
  45. Product Name: KLVL-WXX9-PCB-B1
  46. Version: M1010
  47. Serial Number: BBGZ64219A002847
  48. Asset Tag: N/A
  49. Features:
  50. Board is a hosting board
  51. Board is replaceable
  52. Location In Chassis: Not Specified
  53. Chassis Handle: 0x0003
  54. Type: Motherboard
  55. Contained Object Handles: 0
  56.  
  57. Handle 0x0003, DMI type 3, 22 bytes
  58. Chassis Information
  59. Manufacturer: HUAWEI
  60. Type: Notebook
  61. Lock: Not Present
  62. Version: M1010
  63. Serial Number: YAVBB21912801037
  64. Asset Tag: N/A
  65. Boot-up State: Safe
  66. Power Supply State: Safe
  67. Thermal State: Safe
  68. Security Status: None
  69. OEM Information: 0x00000000
  70. Height: Unspecified
  71. Number Of Power Cords: 1
  72. Contained Elements: 0
  73. SKU Number: KelvinL-WFE9CQ
  74.  
  75. Handle 0x0004, DMI type 4, 48 bytes
  76. Processor Information
  77. Socket Designation: FP6
  78. Type: Central Processor
  79. Family: Zen
  80. Manufacturer: Advanced Micro Devices, Inc.
  81. ID: 01 0F 86 00 FF FB 8B 17
  82. Signature: Family 23, Model 96, Stepping 1
  83. Flags:
  84. FPU (Floating-point unit on-chip)
  85. VME (Virtual mode extension)
  86. DE (Debugging extension)
  87. PSE (Page size extension)
  88. TSC (Time stamp counter)
  89. MSR (Model specific registers)
  90. PAE (Physical address extension)
  91. MCE (Machine check exception)
  92. CX8 (CMPXCHG8 instruction supported)
  93. APIC (On-chip APIC hardware supported)
  94. SEP (Fast system call)
  95. MTRR (Memory type range registers)
  96. PGE (Page global enable)
  97. MCA (Machine check architecture)
  98. CMOV (Conditional move instruction supported)
  99. PAT (Page attribute table)
  100. PSE-36 (36-bit page size extension)
  101. CLFSH (CLFLUSH instruction supported)
  102. MMX (MMX technology supported)
  103. FXSR (FXSAVE and FXSTOR instructions supported)
  104. SSE (Streaming SIMD extensions)
  105. SSE2 (Streaming SIMD extensions 2)
  106. HTT (Multi-threading)
  107. Version: AMD Ryzen 7 4800H with Radeon Graphics
  108. Voltage: Unknown
  109. External Clock: 100 MHz
  110. Max Speed: 4300 MHz
  111. Current Speed: 2900 MHz
  112. Status: Populated, Enabled
  113. Upgrade: None
  114. L1 Cache Handle: 0x0005
  115. L2 Cache Handle: 0x0006
  116. L3 Cache Handle: 0x0007
  117. Serial Number: Not Specified
  118. Asset Tag: Not Specified
  119. Part Number: Not Specified
  120. Core Count: 8
  121. Core Enabled: 8
  122. Thread Count: 16
  123. Characteristics:
  124. 64-bit capable
  125. Multi-Core
  126. Hardware Thread
  127. Execute Protection
  128. Enhanced Virtualization
  129. Power/Performance Control
  130.  
  131. Handle 0x0005, DMI type 7, 27 bytes
  132. Cache Information
  133. Socket Designation: L1 - Cache
  134. Configuration: Enabled, Not Socketed, Level 1
  135. Operational Mode: Write Back
  136. Location: Internal
  137. Installed Size: 512 kB
  138. Maximum Size: 512 kB
  139. Supported SRAM Types:
  140. Pipeline Burst
  141. Installed SRAM Type: Pipeline Burst
  142. Speed: 1 ns
  143. Error Correction Type: Multi-bit ECC
  144. System Type: Unified
  145. Associativity: 8-way Set-associative
  146.  
  147. Handle 0x0006, DMI type 7, 27 bytes
  148. Cache Information
  149. Socket Designation: L2 - Cache
  150. Configuration: Enabled, Not Socketed, Level 2
  151. Operational Mode: Write Back
  152. Location: Internal
  153. Installed Size: 4 MB
  154. Maximum Size: 4 MB
  155. Supported SRAM Types:
  156. Pipeline Burst
  157. Installed SRAM Type: Pipeline Burst
  158. Speed: 1 ns
  159. Error Correction Type: Multi-bit ECC
  160. System Type: Unified
  161. Associativity: 8-way Set-associative
  162.  
  163. Handle 0x0007, DMI type 7, 27 bytes
  164. Cache Information
  165. Socket Designation: L3 - Cache
  166. Configuration: Enabled, Not Socketed, Level 3
  167. Operational Mode: Write Back
  168. Location: Internal
  169. Installed Size: 8 MB
  170. Maximum Size: 8 MB
  171. Supported SRAM Types:
  172. Pipeline Burst
  173. Installed SRAM Type: Pipeline Burst
  174. Speed: 1 ns
  175. Error Correction Type: Multi-bit ECC
  176. System Type: Unified
  177. Associativity: 16-way Set-associative
  178.  
  179. Handle 0x0008, DMI type 9, 19 bytes
  180. System Slot Information
  181. Designation: PCI-1
  182. Type: x1 PCI Express x1
  183. Current Usage: <OUT OF SPEC>
  184. Length: Other
  185. ID: 1
  186. Characteristics:
  187. PME signal is supported
  188. Hot-plug devices are supported
  189. Bus Address: 0000:00:1c.0
  190. Data Bus Width: 8
  191. Peer Devices: 0
  192.  
  193. Handle 0x0009, DMI type 9, 19 bytes
  194. System Slot Information
  195. Designation: PCI-2
  196. Type: x1 PCI Express x1
  197. Current Usage: <OUT OF SPEC>
  198. Length: Other
  199. ID: 2
  200. Characteristics:
  201. PME signal is supported
  202. Hot-plug devices are supported
  203. Bus Address: 0000:00:1c.1
  204. Data Bus Width: 8
  205. Peer Devices: 0
  206.  
  207. Handle 0x000A, DMI type 9, 19 bytes
  208. System Slot Information
  209. Designation: PCI-3
  210. Type: x1 PCI Express x1
  211. Current Usage: <OUT OF SPEC>
  212. Length: Other
  213. ID: 3
  214. Characteristics:
  215. PME signal is supported
  216. Hot-plug devices are supported
  217. Bus Address: 0000:00:1c.2
  218. Data Bus Width: 8
  219. Peer Devices: 0
  220.  
  221. Handle 0x000B, DMI type 9, 19 bytes
  222. System Slot Information
  223. Designation: PCI-4
  224. Type: x1 PCI Express x1
  225. Current Usage: <OUT OF SPEC>
  226. Length: Other
  227. ID: 4
  228. Characteristics:
  229. PME signal is supported
  230. Hot-plug devices are supported
  231. Bus Address: 0000:00:1c.3
  232. Data Bus Width: 8
  233. Peer Devices: 0
  234.  
  235. Handle 0x000C, DMI type 9, 19 bytes
  236. System Slot Information
  237. Designation: PCI-5
  238. Type: x4 PCI Express x4
  239. Current Usage: <OUT OF SPEC>
  240. Length: Other
  241. ID: 5
  242. Characteristics:
  243. PME signal is supported
  244. Hot-plug devices are supported
  245. Bus Address: 0000:00:1c.4
  246. Data Bus Width: 10
  247. Peer Devices: 0
  248.  
  249. Handle 0x000D, DMI type 9, 17 bytes
  250. System Slot Information
  251. Designation: J19
  252. Type: x2 M.2 Socket 3
  253. Current Usage: Available
  254. Length: Short
  255. Characteristics:
  256. 3.3 V is provided
  257. PME signal is supported
  258. Hot-plug devices are supported
  259. Bus Address: 0200:00:01.7
  260.  
  261. Handle 0x000E, DMI type 9, 17 bytes
  262. System Slot Information
  263. Designation: CON1
  264. Type: x4 PCI Express x8
  265. Current Usage: Available
  266. Length: Short
  267. ID: 6
  268. Characteristics:
  269. 3.3 V is provided
  270. PME signal is supported
  271. Hot-plug devices are supported
  272. Bus Address: 0200:00:01.5
  273.  
  274. Handle 0x000F, DMI type 11, 5 bytes
  275. OEM Strings
  276. String 1: $HUA001FR11000
  277. String 2: N/A
  278. String 3: N/A
  279. String 4: KVARO
  280.  
  281. Handle 0x0010, DMI type 13, 22 bytes
  282. BIOS Language Information
  283. Language Description Format: Long
  284. Installable Languages: 2
  285. zh|CN|unicode,0
  286. en|US|iso8859-1,0
  287. Currently Installed Language: en|US|iso8859-1,0
  288.  
  289. Handle 0x0011, DMI type 16, 23 bytes
  290. Physical Memory Array
  291. Location: System Board Or Motherboard
  292. Use: System Memory
  293. Error Correction Type: None
  294. Maximum Capacity: 64 GB
  295. Error Information Handle: Not Provided
  296. Number Of Devices: 2
  297.  
  298. Handle 0x0012, DMI type 17, 84 bytes
  299. Memory Device
  300. Array Handle: 0x0011
  301. Error Information Handle: Not Provided
  302. Total Width: 64 bits
  303. Data Width: 64 bits
  304. Size: 8 GB
  305. Form Factor: Row Of Chips
  306. Set: None
  307. Locator: DIMM 0
  308. Bank Locator: P0 CHANNEL A
  309. Type: DDR4
  310. Type Detail: Synchronous Unbuffered (Unregistered)
  311. Speed: 3200 MT/s
  312. Manufacturer: Samsung
  313. Serial Number: 00000000
  314. Asset Tag: Not Specified
  315. Part Number: M471A1G44AB0-CWE
  316. Rank: 1
  317. Configured Memory Speed: 2667 MT/s
  318. Minimum Voltage: 1.2 V
  319. Maximum Voltage: 1.2 V
  320. Configured Voltage: 1.2 V
  321. Memory Technology: DRAM
  322. Memory Operating Mode Capability: Volatile memory
  323. Firmware Version: Unknown
  324. Module Manufacturer ID: Bank 1, Hex 0xCE
  325. Module Product ID: Unknown
  326. Memory Subsystem Controller Manufacturer ID: Unknown
  327. Memory Subsystem Controller Product ID: Unknown
  328. Non-Volatile Size: None
  329. Volatile Size: 8 GB
  330. Cache Size: None
  331. Logical Size: None
  332.  
  333. Handle 0x0013, DMI type 17, 84 bytes
  334. Memory Device
  335. Array Handle: 0x0011
  336. Error Information Handle: Not Provided
  337. Total Width: 64 bits
  338. Data Width: 64 bits
  339. Size: 8 GB
  340. Form Factor: Row Of Chips
  341. Set: None
  342. Locator: DIMM 0
  343. Bank Locator: P0 CHANNEL B
  344. Type: DDR4
  345. Type Detail: Synchronous Unbuffered (Unregistered)
  346. Speed: 3200 MT/s
  347. Manufacturer: Samsung
  348. Serial Number: 00000000
  349. Asset Tag: Not Specified
  350. Part Number: M471A1G44AB0-CWE
  351. Rank: 1
  352. Configured Memory Speed: 2667 MT/s
  353. Minimum Voltage: 1.2 V
  354. Maximum Voltage: 1.2 V
  355. Configured Voltage: 1.2 V
  356. Memory Technology: DRAM
  357. Memory Operating Mode Capability: Volatile memory
  358. Firmware Version: Unknown
  359. Module Manufacturer ID: Bank 1, Hex 0xCE
  360. Module Product ID: Unknown
  361. Memory Subsystem Controller Manufacturer ID: Unknown
  362. Memory Subsystem Controller Product ID: Unknown
  363. Non-Volatile Size: None
  364. Volatile Size: 8 GB
  365. Cache Size: None
  366. Logical Size: None
  367.  
  368. Handle 0x0014, DMI type 19, 31 bytes
  369. Memory Array Mapped Address
  370. Starting Address: 0x00000000000
  371. Ending Address: 0x003FFFFFFFF
  372. Range Size: 16 GB
  373. Physical Array Handle: 0x0011
  374. Partition Width: 2
  375.  
  376. Handle 0x0015, DMI type 20, 35 bytes
  377. Memory Device Mapped Address
  378. Starting Address: 0x00000000000
  379. Ending Address: 0x003FFFFFFFF
  380. Range Size: 16 GB
  381. Physical Device Handle: 0x0012
  382. Memory Array Mapped Address Handle: 0x0014
  383. Partition Row Position: Unknown
  384. Interleave Position: Unknown
  385. Interleaved Data Depth: Unknown
  386.  
  387. Handle 0x0016, DMI type 20, 35 bytes
  388. Memory Device Mapped Address
  389. Starting Address: 0x00000000000
  390. Ending Address: 0x003FFFFFFFF
  391. Range Size: 16 GB
  392. Physical Device Handle: 0x0013
  393. Memory Array Mapped Address Handle: 0x0014
  394. Partition Row Position: Unknown
  395. Interleave Position: Unknown
  396. Interleaved Data Depth: Unknown
  397.  
  398. Handle 0x0017, DMI type 21, 7 bytes
  399. Built-in Pointing Device
  400. Type: Touch Screen
  401. Interface: Other
  402. Buttons: 1
  403.  
  404. Handle 0x0018, DMI type 22, 26 bytes
  405. Portable Battery
  406. Location: in the back, on the bottom side
  407. Manufacturer: Desay
  408. Manufacture Date: 06/19/2021
  409. Serial Number: 0001
  410. Name: HB4593R1ECW-22T0
  411. Chemistry: Lithium Ion
  412. Design Capacity: 0 mWh
  413. Design Voltage: 7640 mV
  414. SBDS Version: Not Specified
  415. Maximum Error: 1%
  416. OEM-specific Information: 0x00000042
  417.  
  418. Handle 0x0019, DMI type 248, 12 bytes
  419. OEM-specific Type
  420. Header and Data:
  421. F8 0C 19 00 01 4C E0 00 00 00 20 00
  422.  
  423. Handle 0xFEFF, DMI type 127, 4 bytes
  424. End Of Table
  425.  
  426.  
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