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  1. RAMMon v1.0 Build: 1016 built with SysInfo v1.0 Build: 1121
  2. PassMark (R) Software
  3. www.passmark.com
  4.  
  5. Memmory summary for TOM-PC:
  6. Number of Memory Devices: 1 Total Physical Memory: 3947 MB (4096 MB)
  7. Total Available Physical Memory: 779 MB
  8. Memory Load: 80%
  9.  
  10. Item | Slot #1 | Slot #2 | Slot #3 | Slot #4 |
  11. -------------------------------------------------------------------------------|------------------------|-----------------|-----------------|-----------------|-
  12. Ram Type | DDR3 | Not Populated | Not Populated | Not Populated |
  13. Maximum Clock Speed (MHz) | 667 (JEDEC) | | | |
  14. Maximum Transfer Speed (MHz) | DDR3-1333 | | | |
  15. Maximum Bandwidth (MB/s) | PC3-10600 | | | |
  16. Memory Capacity (MB) | 4096 | | | |
  17. Jedec Manufacture Name | Elpida | | | |
  18. Search Amazon.com | Search! | | | |
  19. SPD Revision | 1.0 | | | |
  20. Registered | No | | | |
  21. ECC | No | | | |
  22. DIMM Slot # | 1 | | | |
  23. Manufactured | Week 42 of Year 2011 | | | |
  24. Module Part # | EBJ41UF8BCS0-DJ-F | | | |
  25. Module Revision | 0x3020 | | | |
  26. Module Serial # | 0x3E522BD8 | | | |
  27. Module Manufacturing Location | 75 | | | |
  28. # of Row Addressing Bits | 15 | | | |
  29. # of Column Addressing Bits | 10 | | | |
  30. # of Banks | 8 | | | |
  31. # of Ranks | 2 | | | |
  32. Device Width in Bits | 8 | | | |
  33. Bus Width in Bits | 64 | | | |
  34. Module Voltage | 1.5V | | | |
  35. CAS Latencies Supported | 5 6 7 8 9 10 | | | |
  36. Timings @ Max Frequency (JEDEC) | 9-9-9-24 | | | |
  37. Maximum frequency (MHz) | 667 | | | |
  38. Maximum Transfer Speed (MHz) | DDR3-1333 | | | |
  39. Maximum Bandwidth (MB/s) | PC3-10600 | | | |
  40. Minimum Clock Cycle Time, tCK (ns) | 1.500 | | | |
  41. Minimum CAS Latency Time, tAA (ns) | 13.125 | | | |
  42. Minimum RAS to CAS Delay, tRCD (ns) | 13.125 | | | |
  43. Minimum Row Precharge Time, tRP (ns) | 13.125 | | | |
  44. Minimum Active to Precharge Time, tRAS (ns) | 36.000 | | | |
  45. Minimum Row Active to Row Active Delay, tRRD (ns) | 6.000 | | | |
  46. Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns) | 49.125 | | | |
  47. Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns) | 160.000 | | | |
  48. | | | | |
  49. DDR3 Specific SPD Attributes | | | | |
  50. Write Recovery Time, tWR (ns) | 15.000 | | | |
  51. Internal Write to Read Command Delay, tWTR (ns) | 7.500 | | | |
  52. Internal Read to Precharge Command Delay, tRTP (ns) | 7.500 | | | |
  53. Minimum Four Activate Window Delay, tFAW (ns) | 30.000 | | | |
  54. Maximum Activate Window in units of tREFI | 0 | | | |
  55. RZQ / 6 Supported | Yes | | | |
  56. RZQ / 7 Supported | Yes | | | |
  57. DLL-Off Mode Supported | Yes | | | |
  58. Maximum Operating Temperature Range (C) | 0-95 | | | |
  59. Refresh Rate at Extended Operating Temperature Range | 2X | | | |
  60. Auto-self Refresh Supported | No | | | |
  61. On-die Thermal Sensor Readout Supported | No | | | |
  62. Partial Array Self Refresh Supported | Yes | | | |
  63. Thermal Sensor Present | No | | | |
  64. Non-standard SDRAM Type | Standard Monolithic | | | |
  65. Maxium Activate Count (MAC) | | | | |
  66. Module Type | SO-DIMM | | | |
  67. Module Height (mm) | 30 | | | |
  68. Module Thickness (front), (mm) | 2 | | | |
  69. Module Thickness (back), (mm) | 2 | | | |
  70. Module Width (mm) | 67.6 | | | |
  71. Reference Raw Card Used | Raw Card F Rev. 2 | | | |
  72. DRAM Manufacture | Elpida | | | |
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