Ram Type	DDR3	DDR3	DDR3	Not Populated
Maximum Clock Speed (MHz)	667 (JEDEC)	667 (JEDEC)	667 (JEDEC)
Maximum Transfer Speed (MHz)	DDR3-1333	DDR3-1333	DDR3-1333
Maximum Bandwidth (MB/s)	PC3-10600	PC3-10600	PC3-10600
Memory Capacity (MB)	4096	2048	2048
Jedec Manufacture Name		Samsung	Samsung
Search Amazon.com	Search!	Search!	Search!
SPD Revision	1.0	1.0	1.0
Registered	No	No	No
ECC	No	No	No
DIMM Slot #	1	2	3
Manufactured		Week 30 of Year 2010	Week 30 of Year 2010
Module Part #		M378B5673FH0-CH9	M378B5673FH0-CH9
Module Revision	0x0	0x0	0x0
Module Serial #	0x0	0x6511DD08	0x92CC48BA
Module Manufacturing Location	0	2	2
# of Row Addressing Bits	15	14	14
# of Column Addressing Bits	10	10	10
# of Banks	8	8	8
# of Ranks	2	2	2
Device Width in Bits	8	8	8
Bus Width in Bits	64	64	64
Module Voltage	1.5V	1.5V	1.5V
CAS Latencies Supported	6 7 8 9	6 7 8 9	6 7 8 9
Timings @ Max Frequency (JEDEC)	9-9-9-24	9-9-9-24	9-9-9-24
Maximum frequency (MHz)	667	667	667
Maximum Transfer Speed (MHz)	DDR3-1333	DDR3-1333	DDR3-1333
Maximum Bandwidth (MB/s)	PC3-10600	PC3-10600	PC3-10600
Minimum Clock Cycle Time, tCK (ns)	1.500	1.500	1.500
Minimum CAS Latency Time, tAA (ns)	13.125	13.125	13.125
Minimum RAS to CAS Delay, tRCD (ns)	13.125	13.125	13.125
Minimum Row Precharge Time, tRP (ns)	13.125	13.125	13.125
Minimum Active to Precharge Time, tRAS (ns)	36.000	36.000	36.000
Minimum Row Active to Row Active Delay, tRRD (ns)	6.000	6.000	6.000
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns)	49.125	49.125	49.125
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns)	160.000	110.000	110.000
DDR3 Specific SPD Attributes
Write Recovery Time, tWR (ns)	15.000	15.000	15.000
Internal Write to Read Command Delay, tWTR (ns)	7.500	7.500	7.500
Internal Read to Precharge Command Delay, tRTP (ns)	7.500	7.500	7.500
Minimum Four Activate Window Delay, tFAW (ns)	30.000	30.000	30.000
Maximum Activate Window in units of tREFI	0	0	0
RZQ / 6 Supported	Yes	Yes	Yes
RZQ / 7 Supported	Yes	Yes	Yes
DLL-Off Mode Supported	Yes	Yes	Yes
Maximum Operating Temperature Range (C)	0-95	0-95	0-95
Refresh Rate at Extended Operating Temperature Range	2X	2X	2X
Auto-self Refresh Supported	Yes	No	No
On-die Thermal Sensor Readout Supported	No	No	No
Partial Array Self Refresh Supported	No	No	No
Thermal Sensor Present	No	No	No
Non-standard SDRAM Type	Standard Monolithic	Standard Monolithic	Standard Monolithic
Maxium Activate Count (MAC)
Module Type	UDIMM	UDIMM	UDIMM
Module Height (mm)	30	30	30
Module Thickness (front), (mm)	2	2	2
Module Thickness (back), (mm)	2	2	2
Module Width (mm)	133.5	133.5	133.5
Reference Raw Card Used	Raw Card B Rev. 0	Raw Card B Rev. 0	Raw Card B Rev. 0
DRAM Manufacture		Samsung	Samsung