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  1. 00:00.0 Host bridge: Advanced Micro Devices, Inc. [AMD] Device 14b5 (rev 01)
  2. Subsystem: Xiaomi Device 2113
  3. Flags: fast devsel
  4.  
  5. 00:00.2 IOMMU: Advanced Micro Devices, Inc. [AMD] Device 14b6
  6. Subsystem: Xiaomi Device 2113
  7. Flags: bus master, fast devsel, latency 0, IRQ 25
  8. Capabilities: [40] Secure device <?>
  9. Capabilities: [64] MSI: Enable+ Count=1/4 Maskable- 64bit+
  10. Capabilities: [74] HyperTransport: MSI Mapping Enable+ Fixed+
  11.  
  12. 00:01.0 Host bridge: Advanced Micro Devices, Inc. [AMD] Device 14b7 (rev 01)
  13. Flags: fast devsel, IOMMU group 0
  14.  
  15. 00:02.0 Host bridge: Advanced Micro Devices, Inc. [AMD] Device 14b7 (rev 01)
  16. Flags: fast devsel, IOMMU group 1
  17.  
  18. 00:02.2 PCI bridge: Advanced Micro Devices, Inc. [AMD] Device 14ba (prog-if 00 [Normal decode])
  19. Flags: bus master, fast devsel, latency 0, IRQ 30, IOMMU group 2
  20. Bus: primary=00, secondary=01, subordinate=01, sec-latency=0
  21. I/O behind bridge: 00002000-00002fff [size=4K]
  22. Memory behind bridge: c0900000-c09fffff [size=1M]
  23. Prefetchable memory behind bridge: [disabled]
  24. Capabilities: [50] Power Management version 3
  25. Capabilities: [58] Express Root Port (Slot+), MSI 00
  26. Capabilities: [a0] MSI: Enable+ Count=1/1 Maskable- 64bit+
  27. Capabilities: [c0] Subsystem: Advanced Micro Devices, Inc. [AMD] Device 1453
  28. Capabilities: [c8] HyperTransport: MSI Mapping Enable+ Fixed+
  29. Capabilities: [100] Vendor Specific Information: ID=0001 Rev=1 Len=010 <?>
  30. Capabilities: [150] Advanced Error Reporting
  31. Capabilities: [270] Secondary PCI Express
  32. Capabilities: [2a0] Access Control Services
  33. Capabilities: [370] L1 PM Substates
  34. Capabilities: [400] Data Link Feature <?>
  35. Capabilities: [410] Physical Layer 16.0 GT/s <?>
  36. Capabilities: [440] Lane Margining at the Receiver <?>
  37. Kernel driver in use: pcieport
  38.  
  39. 00:02.3 PCI bridge: Advanced Micro Devices, Inc. [AMD] Device 14ba (prog-if 00 [Normal decode])
  40. Flags: bus master, fast devsel, latency 0, IRQ 31, IOMMU group 3
  41. Bus: primary=00, secondary=02, subordinate=02, sec-latency=0
  42. I/O behind bridge: 00003000-00003fff [size=4K]
  43. Memory behind bridge: c0800000-c08fffff [size=1M]
  44. Prefetchable memory behind bridge: 0000000460200000-00000004603fffff [size=2M]
  45. Capabilities: [50] Power Management version 3
  46. Capabilities: [58] Express Root Port (Slot+), MSI 00
  47. Capabilities: [a0] MSI: Enable+ Count=1/1 Maskable- 64bit+
  48. Capabilities: [c0] Subsystem: Advanced Micro Devices, Inc. [AMD] Device 1453
  49. Capabilities: [c8] HyperTransport: MSI Mapping Enable+ Fixed+
  50. Capabilities: [100] Vendor Specific Information: ID=0001 Rev=1 Len=010 <?>
  51. Capabilities: [150] Advanced Error Reporting
  52. Capabilities: [270] Secondary PCI Express
  53. Capabilities: [2a0] Access Control Services
  54. Capabilities: [370] L1 PM Substates
  55. Capabilities: [400] Data Link Feature <?>
  56. Capabilities: [410] Physical Layer 16.0 GT/s <?>
  57. Capabilities: [440] Lane Margining at the Receiver <?>
  58. Kernel driver in use: pcieport
  59.  
  60. 00:03.0 Host bridge: Advanced Micro Devices, Inc. [AMD] Device 14b7 (rev 01)
  61. Flags: fast devsel, IOMMU group 4
  62.  
  63. 00:04.0 Host bridge: Advanced Micro Devices, Inc. [AMD] Device 14b7 (rev 01)
  64. Flags: fast devsel, IOMMU group 5
  65.  
  66. 00:08.0 Host bridge: Advanced Micro Devices, Inc. [AMD] Device 14b7 (rev 01)
  67. Flags: fast devsel, IOMMU group 6
  68.  
  69. 00:08.1 PCI bridge: Advanced Micro Devices, Inc. [AMD] Device 14b9 (rev 10) (prog-if 00 [Normal decode])
  70. Flags: bus master, fast devsel, latency 0, IRQ 32, IOMMU group 7
  71. Bus: primary=00, secondary=03, subordinate=03, sec-latency=0
  72. I/O behind bridge: 00001000-00001fff [size=4K]
  73. Memory behind bridge: c0300000-c07fffff [size=5M]
  74. Prefetchable memory behind bridge: 0000007ee0000000-0000007ef01fffff [size=258M]
  75. Capabilities: [50] Power Management version 3
  76. Capabilities: [58] Express Root Port (Slot-), MSI 00
  77. Capabilities: [a0] MSI: Enable+ Count=1/1 Maskable- 64bit+
  78. Capabilities: [c0] Subsystem: Advanced Micro Devices, Inc. [AMD] Device 14b9
  79. Capabilities: [100] Vendor Specific Information: ID=0001 Rev=1 Len=010 <?>
  80. Capabilities: [270] Secondary PCI Express
  81. Capabilities: [2a0] Access Control Services
  82. Capabilities: [400] Data Link Feature <?>
  83. Capabilities: [410] Physical Layer 16.0 GT/s <?>
  84. Capabilities: [450] Lane Margining at the Receiver <?>
  85. Kernel driver in use: pcieport
  86.  
  87. 00:08.3 PCI bridge: Advanced Micro Devices, Inc. [AMD] Device 14b9 (rev 10) (prog-if 00 [Normal decode])
  88. Flags: bus master, fast devsel, latency 0, IRQ 33, IOMMU group 8
  89. Bus: primary=00, secondary=04, subordinate=04, sec-latency=0
  90. I/O behind bridge: [disabled]
  91. Memory behind bridge: c0000000-c02fffff [size=3M]
  92. Prefetchable memory behind bridge: [disabled]
  93. Capabilities: [50] Power Management version 3
  94. Capabilities: [58] Express Root Port (Slot-), MSI 00
  95. Capabilities: [a0] MSI: Enable+ Count=1/1 Maskable- 64bit+
  96. Capabilities: [c0] Subsystem: Advanced Micro Devices, Inc. [AMD] Device 14b9
  97. Capabilities: [100] Vendor Specific Information: ID=0001 Rev=1 Len=010 <?>
  98. Capabilities: [150] Advanced Error Reporting
  99. Capabilities: [270] Secondary PCI Express
  100. Capabilities: [2a0] Access Control Services
  101. Capabilities: [400] Data Link Feature <?>
  102. Capabilities: [410] Physical Layer 16.0 GT/s <?>
  103. Capabilities: [450] Lane Margining at the Receiver <?>
  104. Kernel driver in use: pcieport
  105.  
  106. 00:14.0 SMBus: Advanced Micro Devices, Inc. [AMD] FCH SMBus Controller (rev 71)
  107. Subsystem: Xiaomi FCH SMBus Controller
  108. Flags: 66MHz, medium devsel, IOMMU group 9
  109. Kernel driver in use: piix4_smbus
  110. Kernel modules: i2c_piix4, sp5100_tco
  111.  
  112. 00:14.3 ISA bridge: Advanced Micro Devices, Inc. [AMD] FCH LPC Bridge (rev 51)
  113. Subsystem: Xiaomi FCH LPC Bridge
  114. Flags: bus master, 66MHz, medium devsel, latency 0, IOMMU group 9
  115.  
  116. 00:18.0 Host bridge: Advanced Micro Devices, Inc. [AMD] Device 1679
  117. Flags: fast devsel, IOMMU group 10
  118.  
  119. 00:18.1 Host bridge: Advanced Micro Devices, Inc. [AMD] Device 167a
  120. Flags: fast devsel, IOMMU group 10
  121.  
  122. 00:18.2 Host bridge: Advanced Micro Devices, Inc. [AMD] Device 167b
  123. Flags: fast devsel, IOMMU group 10
  124.  
  125. 00:18.3 Host bridge: Advanced Micro Devices, Inc. [AMD] Device 167c
  126. Flags: fast devsel, IOMMU group 10
  127. Kernel driver in use: k10temp
  128. Kernel modules: k10temp
  129.  
  130. 00:18.4 Host bridge: Advanced Micro Devices, Inc. [AMD] Device 167d
  131. Flags: fast devsel, IOMMU group 10
  132.  
  133. 00:18.5 Host bridge: Advanced Micro Devices, Inc. [AMD] Device 167e
  134. Flags: fast devsel, IOMMU group 10
  135.  
  136. 00:18.6 Host bridge: Advanced Micro Devices, Inc. [AMD] Device 167f
  137. Flags: fast devsel, IOMMU group 10
  138.  
  139. 00:18.7 Host bridge: Advanced Micro Devices, Inc. [AMD] Device 1680
  140. Flags: fast devsel, IOMMU group 10
  141.  
  142. 01:00.0 Network controller: Realtek Semiconductor Co., Ltd. Device b852
  143. Subsystem: Device 1d3e:c826
  144. Flags: fast devsel, IRQ 255, IOMMU group 11
  145. I/O ports at 2000 [disabled] [size=256]
  146. Memory at c0900000 (64-bit, non-prefetchable) [disabled] [size=1M]
  147. Capabilities: [40] Power Management version 3
  148. Capabilities: [50] MSI: Enable- Count=1/1 Maskable- 64bit+
  149. Capabilities: [70] Express Endpoint, MSI 00
  150. Capabilities: [100] Advanced Error Reporting
  151. Capabilities: [148] Device Serial Number 00-e0-4c-ff-fe-88-52-01
  152. Capabilities: [158] Latency Tolerance Reporting
  153. Capabilities: [160] L1 PM Substates
  154.  
  155. 02:00.0 Unassigned class [ff00]: Realtek Semiconductor Co., Ltd. RTS525A PCI Express Card Reader (rev 01)
  156. Subsystem: Realtek Semiconductor Co., Ltd. RTS525A PCI Express Card Reader
  157. Physical Slot: 0
  158. Flags: bus master, fast devsel, latency 0, IRQ 36, IOMMU group 12
  159. Memory at c0800000 (32-bit, non-prefetchable) [size=4K]
  160. Capabilities: [80] Power Management version 3
  161. Capabilities: [90] MSI: Enable+ Count=1/1 Maskable- 64bit+
  162. Capabilities: [b0] Express Endpoint, MSI 00
  163. Capabilities: [100] Advanced Error Reporting
  164. Capabilities: [148] Device Serial Number 00-00-00-01-00-4c-e0-00
  165. Capabilities: [158] Latency Tolerance Reporting
  166. Capabilities: [160] L1 PM Substates
  167. Kernel driver in use: rtsx_pci
  168. Kernel modules: rtsx_pci
  169.  
  170. 03:00.0 VGA compatible controller: Advanced Micro Devices, Inc. [AMD/ATI] Rembrandt (rev 02) (prog-if 00 [VGA controller])
  171. DeviceName: Realtek
  172. Subsystem: Xiaomi Device 2113
  173. Flags: bus master, fast devsel, latency 0, IRQ 46, IOMMU group 13
  174. Memory at 7ee0000000 (64-bit, prefetchable) [size=256M]
  175. Memory at 7ef0000000 (64-bit, prefetchable) [size=2M]
  176. I/O ports at 1000 [size=256]
  177. Memory at c0700000 (32-bit, non-prefetchable) [size=512K]
  178. Capabilities: [48] Vendor Specific Information: Len=08 <?>
  179. Capabilities: [50] Power Management version 3
  180. Capabilities: [64] Express Legacy Endpoint, MSI 00
  181. Capabilities: [a0] MSI: Enable- Count=1/4 Maskable- 64bit+
  182. Capabilities: [c0] MSI-X: Enable+ Count=4 Masked-
  183. Capabilities: [100] Vendor Specific Information: ID=0001 Rev=1 Len=010 <?>
  184. Capabilities: [270] Secondary PCI Express
  185. Capabilities: [2a0] Access Control Services
  186. Capabilities: [2b0] Address Translation Service (ATS)
  187. Capabilities: [2c0] Page Request Interface (PRI)
  188. Capabilities: [2d0] Process Address Space ID (PASID)
  189. Capabilities: [410] Physical Layer 16.0 GT/s <?>
  190. Capabilities: [450] Lane Margining at the Receiver <?>
  191. Kernel driver in use: amdgpu
  192. Kernel modules: amdgpu
  193.  
  194. 03:00.1 Audio device: Advanced Micro Devices, Inc. [AMD/ATI] Device 1640
  195. Subsystem: Xiaomi Device 2113
  196. Flags: bus master, fast devsel, latency 0, IRQ 88, IOMMU group 14
  197. Memory at c07c8000 (32-bit, non-prefetchable) [size=16K]
  198. Capabilities: [48] Vendor Specific Information: Len=08 <?>
  199. Capabilities: [50] Power Management version 3
  200. Capabilities: [64] Express Legacy Endpoint, MSI 00
  201. Capabilities: [a0] MSI: Enable+ Count=1/1 Maskable- 64bit+
  202. Capabilities: [100] Vendor Specific Information: ID=0001 Rev=1 Len=010 <?>
  203. Capabilities: [2a0] Access Control Services
  204. Kernel driver in use: snd_hda_intel
  205. Kernel modules: snd_hda_intel
  206.  
  207. 03:00.2 Encryption controller: Advanced Micro Devices, Inc. [AMD] VanGogh PSP/CCP
  208. Subsystem: Xiaomi VanGogh PSP/CCP
  209. Flags: bus master, fast devsel, latency 0, IRQ 24, IOMMU group 15
  210. Memory at c0600000 (32-bit, non-prefetchable) [size=1M]
  211. Memory at c07ce000 (32-bit, non-prefetchable) [size=8K]
  212. Capabilities: [48] Vendor Specific Information: Len=08 <?>
  213. Capabilities: [50] Power Management version 3
  214. Capabilities: [64] Express Endpoint, MSI 00
  215. Capabilities: [a0] MSI: Enable- Count=1/2 Maskable- 64bit+
  216. Capabilities: [c0] MSI-X: Enable+ Count=2 Masked-
  217. Capabilities: [100] Vendor Specific Information: ID=0001 Rev=1 Len=010 <?>
  218. Capabilities: [2a0] Access Control Services
  219. Kernel driver in use: ccp
  220. Kernel modules: ccp
  221.  
  222. 03:00.3 USB controller: Advanced Micro Devices, Inc. [AMD] Device 161d (prog-if 30 [XHCI])
  223. Subsystem: Xiaomi Device 2113
  224. Flags: bus master, fast devsel, latency 0, IRQ 35, IOMMU group 16
  225. Memory at c0300000 (64-bit, non-prefetchable) [size=1M]
  226. Capabilities: [48] Vendor Specific Information: Len=08 <?>
  227. Capabilities: [50] Power Management version 3
  228. Capabilities: [64] Express Endpoint, MSI 00
  229. Capabilities: [a0] MSI: Enable- Count=1/8 Maskable- 64bit+
  230. Capabilities: [c0] MSI-X: Enable+ Count=8 Masked-
  231. Capabilities: [100] Vendor Specific Information: ID=0001 Rev=1 Len=010 <?>
  232. Capabilities: [2a0] Access Control Services
  233. Kernel driver in use: xhci_hcd
  234. Kernel modules: xhci_pci
  235.  
  236. 03:00.4 USB controller: Advanced Micro Devices, Inc. [AMD] Device 161e (prog-if 30 [XHCI])
  237. Subsystem: Xiaomi Device 2113
  238. Flags: bus master, fast devsel, latency 0, IRQ 46, IOMMU group 17
  239. Memory at c0400000 (64-bit, non-prefetchable) [size=1M]
  240. Capabilities: [48] Vendor Specific Information: Len=08 <?>
  241. Capabilities: [50] Power Management version 3
  242. Capabilities: [64] Express Endpoint, MSI 00
  243. Capabilities: [a0] MSI: Enable- Count=1/8 Maskable- 64bit+
  244. Capabilities: [c0] MSI-X: Enable+ Count=8 Masked-
  245. Capabilities: [100] Vendor Specific Information: ID=0001 Rev=1 Len=010 <?>
  246. Capabilities: [2a0] Access Control Services
  247. Kernel driver in use: xhci_hcd
  248. Kernel modules: xhci_pci
  249.  
  250. 03:00.5 Multimedia controller: Advanced Micro Devices, Inc. [AMD] Raven/Raven2/FireFlight/Renoir Audio Processor (rev 60)
  251. Subsystem: Xiaomi Raven/Raven2/FireFlight/Renoir Audio Processor
  252. Flags: fast devsel, IRQ 255, IOMMU group 18
  253. Memory at c0780000 (32-bit, non-prefetchable) [disabled] [size=256K]
  254. Capabilities: [48] Vendor Specific Information: Len=08 <?>
  255. Capabilities: [50] Power Management version 3
  256. Capabilities: [64] Express Endpoint, MSI 00
  257. Capabilities: [a0] MSI: Enable- Count=1/1 Maskable- 64bit+
  258. Capabilities: [100] Vendor Specific Information: ID=0001 Rev=1 Len=010 <?>
  259. Capabilities: [2a0] Access Control Services
  260. Kernel modules: snd_pci_acp3x, snd_rn_pci_acp3x, snd_pci_acp5x
  261.  
  262. 03:00.6 Audio device: Advanced Micro Devices, Inc. [AMD] Family 17h (Models 10h-1fh) HD Audio Controller
  263. Subsystem: Xiaomi Family 17h (Models 10h-1fh) HD Audio Controller
  264. Flags: bus master, fast devsel, latency 0, IRQ 89, IOMMU group 19
  265. Memory at c07c0000 (32-bit, non-prefetchable) [size=32K]
  266. Capabilities: [48] Vendor Specific Information: Len=08 <?>
  267. Capabilities: [50] Power Management version 3
  268. Capabilities: [64] Express Endpoint, MSI 00
  269. Capabilities: [a0] MSI: Enable+ Count=1/1 Maskable- 64bit+
  270. Capabilities: [100] Vendor Specific Information: ID=0001 Rev=1 Len=010 <?>
  271. Capabilities: [2a0] Access Control Services
  272. Kernel driver in use: snd_hda_intel
  273. Kernel modules: snd_hda_intel
  274.  
  275. 03:00.7 Signal processing controller: Advanced Micro Devices, Inc. [AMD] Raven/Raven2/Renoir Sensor Fusion Hub
  276. Subsystem: Xiaomi Raven/Raven2/Renoir Sensor Fusion Hub
  277. Flags: bus master, fast devsel, latency 0, IRQ 35, IOMMU group 20
  278. Memory at c0500000 (32-bit, non-prefetchable) [size=1M]
  279. Memory at c07cc000 (32-bit, non-prefetchable) [size=8K]
  280. Capabilities: [48] Vendor Specific Information: Len=08 <?>
  281. Capabilities: [50] Power Management version 3
  282. Capabilities: [64] Express Endpoint, MSI 00
  283. Capabilities: [a0] MSI: Enable- Count=1/2 Maskable- 64bit+
  284. Capabilities: [c0] MSI-X: Enable- Count=2 Masked-
  285. Capabilities: [100] Vendor Specific Information: ID=0001 Rev=1 Len=010 <?>
  286. Capabilities: [2a0] Access Control Services
  287. Kernel driver in use: pcie_mp2_amd
  288. Kernel modules: amd_sfh
  289.  
  290. 04:00.0 USB controller: Advanced Micro Devices, Inc. [AMD] Device 161f (prog-if 30 [XHCI])
  291. Subsystem: Xiaomi Device 2113
  292. Flags: bus master, fast devsel, latency 0, IRQ 55, IOMMU group 21
  293. Memory at c0000000 (64-bit, non-prefetchable) [size=1M]
  294. Capabilities: [48] Vendor Specific Information: Len=08 <?>
  295. Capabilities: [50] Power Management version 3
  296. Capabilities: [64] Express Endpoint, MSI 00
  297. Capabilities: [a0] MSI: Enable- Count=1/8 Maskable- 64bit+
  298. Capabilities: [c0] MSI-X: Enable+ Count=8 Masked-
  299. Capabilities: [100] Vendor Specific Information: ID=0001 Rev=1 Len=010 <?>
  300. Capabilities: [270] Secondary PCI Express
  301. Capabilities: [2a0] Access Control Services
  302. Capabilities: [410] Physical Layer 16.0 GT/s <?>
  303. Capabilities: [450] Lane Margining at the Receiver <?>
  304. Kernel driver in use: xhci_hcd
  305. Kernel modules: xhci_pci
  306.  
  307. 04:00.3 USB controller: Advanced Micro Devices, Inc. [AMD] Device 15d6 (prog-if 30 [XHCI])
  308. Subsystem: Xiaomi Device 2113
  309. Flags: bus master, fast devsel, latency 0, IRQ 64, IOMMU group 22
  310. Memory at c0100000 (64-bit, non-prefetchable) [size=1M]
  311. Capabilities: [48] Vendor Specific Information: Len=08 <?>
  312. Capabilities: [50] Power Management version 3
  313. Capabilities: [64] Express Endpoint, MSI 00
  314. Capabilities: [a0] MSI: Enable- Count=1/8 Maskable- 64bit+
  315. Capabilities: [c0] MSI-X: Enable+ Count=8 Masked-
  316. Capabilities: [100] Vendor Specific Information: ID=0001 Rev=1 Len=010 <?>
  317. Capabilities: [2a0] Access Control Services
  318. Kernel driver in use: xhci_hcd
  319. Kernel modules: xhci_pci
  320.  
  321. 04:00.4 USB controller: Advanced Micro Devices, Inc. [AMD] Device 15d7 (prog-if 30 [XHCI])
  322. Subsystem: Xiaomi Device 2113
  323. Flags: bus master, fast devsel, latency 0, IRQ 73, IOMMU group 23
  324. Memory at c0200000 (64-bit, non-prefetchable) [size=1M]
  325. Capabilities: [48] Vendor Specific Information: Len=08 <?>
  326. Capabilities: [50] Power Management version 3
  327. Capabilities: [64] Express Endpoint, MSI 00
  328. Capabilities: [a0] MSI: Enable- Count=1/8 Maskable- 64bit+
  329. Capabilities: [c0] MSI-X: Enable+ Count=8 Masked-
  330. Capabilities: [100] Vendor Specific Information: ID=0001 Rev=1 Len=010 <?>
  331. Capabilities: [2a0] Access Control Services
  332. Kernel driver in use: xhci_hcd
  333. Kernel modules: xhci_pci
  334.  
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