Sand to Circuits

Etching:

-Washing off of Photo Resist: All of the photo resist is

dissolved by a solvent, which reveals a pattern of the photo

resist made by the mask.

-Etching: There is a material that is protected by the photo

resist becuase it should not be etched away. The revealed

material will be etched away with special chemicals.

-Removing Photo Resist: The photo resist is removed and the

desired shape becomes visible after the etching.


Ion Implantation:

-Applying Photo Resist: The photo resist will protect material

that should not get ions implanted.

-Ion implantation:The exposed silicon are hit with chemicals

impurities called Ions, which are put in the silicon to conduct

electricity. Ions are shot at a high speed.

-Removing Photo Resist: The photo resist is removed and the

desired shape becomes visible after the etching.


Metal Deposition:

-Ready Transistor: 3 holes etched to insulation layer above

transistor, which are filled with copper.

-Electroplating: Copper ions are deposited onto, then they go

through positive terminal and other stuff.

-After Electroplating: On the water surface the copper ions

settle as thin layer of copper.