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Mar 12th, 2017
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  1. RAMMon v1.0 Build: 1016 built with SysInfo v1.0 Build: 1121
  2. PassMark (R) Software
  3. www.passmark.com
  4.  
  5. Memmory summary for DESKTOP-FB0H18N:
  6. Number of Memory Devices: 2 Total Physical Memory: 8088 MB (8192 MB)
  7. Total Available Physical Memory: 5261 MB
  8. Memory Load: 34%
  9.  
  10. Item | Slot #1 | Slot #2 | Slot #3 | Slot #4 |
  11. -------------------------------------------------------------------------------|-----------------------|-----------------------|-----------------|-----------------|-
  12. Ram Type | DDR3 | DDR3 | Not Populated | Not Populated |
  13. Maximum Clock Speed (MHz) | 934 (XMP) | 934 (XMP) | | |
  14. Maximum Transfer Speed (MHz) | DDR3-1867 | DDR3-1867 | | |
  15. Maximum Bandwidth (MB/s) | PC3-14900 | PC3-14900 | | |
  16. Memory Capacity (MB) | 4096 | 4096 | | |
  17. Jedec Manufacture Name | A-DATA Technology | A-DATA Technology | | |
  18. Search Amazon.com | Search! | Search! | | |
  19. SPD Revision | 1.1 | 1.1 | | |
  20. Registered | No | No | | |
  21. ECC | No | No | | |
  22. DIMM Slot # | 1 | 2 | | |
  23. Manufactured | Week 6 of Year 2014 | Week 6 of Year 2014 | | |
  24. Module Part # | DDR3 1866 | DDR3 1866 | | |
  25. Module Revision | 0x0 | 0x0 | | |
  26. Module Serial # | 0x6814 | 0x67E1 | | |
  27. Module Manufacturing Location | 1 | 1 | | |
  28. # of Row Addressing Bits | 16 | 16 | | |
  29. # of Column Addressing Bits | 10 | 10 | | |
  30. # of Banks | 8 | 8 | | |
  31. # of Ranks | 1 | 1 | | |
  32. Device Width in Bits | 8 | 8 | | |
  33. Bus Width in Bits | 64 | 64 | | |
  34. Module Voltage | 1.5V | 1.5V | | |
  35. CAS Latencies Supported | 5 6 7 8 9 | 5 6 7 8 9 | | |
  36. Timings @ Max Frequency (JEDEC) | 9-9-9-24 | 9-9-9-24 | | |
  37. Maximum frequency (MHz) | 667 | 667 | | |
  38. Maximum Transfer Speed (MHz) | DDR3-1333 | DDR3-1333 | | |
  39. Maximum Bandwidth (MB/s) | PC3-10600 | PC3-10600 | | |
  40. Minimum Clock Cycle Time, tCK (ns) | 1.500 | 1.500 | | |
  41. Minimum CAS Latency Time, tAA (ns) | 13.125 | 13.125 | | |
  42. Minimum RAS to CAS Delay, tRCD (ns) | 13.125 | 13.125 | | |
  43. Minimum Row Precharge Time, tRP (ns) | 13.125 | 13.125 | | |
  44. Minimum Active to Precharge Time, tRAS (ns) | 36.000 | 36.000 | | |
  45. Minimum Row Active to Row Active Delay, tRRD (ns) | 6.000 | 6.000 | | |
  46. Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns) | 49.125 | 49.125 | | |
  47. Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns) | 260.000 | 260.000 | | |
  48. | | | | |
  49. DDR3 Specific SPD Attributes | | | | |
  50. Write Recovery Time, tWR (ns) | 15.000 | 15.000 | | |
  51. Internal Write to Read Command Delay, tWTR (ns) | 7.500 | 7.500 | | |
  52. Internal Read to Precharge Command Delay, tRTP (ns) | 7.500 | 7.500 | | |
  53. Minimum Four Activate Window Delay, tFAW (ns) | 30.000 | 30.000 | | |
  54. Maximum Activate Window in units of tREFI | 0 | 0 | | |
  55. RZQ / 6 Supported | Yes | Yes | | |
  56. RZQ / 7 Supported | Yes | Yes | | |
  57. DLL-Off Mode Supported | Yes | Yes | | |
  58. Maximum Operating Temperature Range (C) | 0-95 | 0-95 | | |
  59. Refresh Rate at Extended Operating Temperature Range | 2X | 2X | | |
  60. Auto-self Refresh Supported | Yes | Yes | | |
  61. On-die Thermal Sensor Readout Supported | No | No | | |
  62. Partial Array Self Refresh Supported | No | No | | |
  63. Thermal Sensor Present | No | No | | |
  64. Non-standard SDRAM Type | Standard Monolithic | Standard Monolithic | | |
  65. Maxium Activate Count (MAC) | | | | |
  66. Module Type | UDIMM | UDIMM | | |
  67. Module Height (mm) | 30 | 30 | | |
  68. Module Thickness (front), (mm) | 2 | 2 | | |
  69. Module Thickness (back), (mm) | 2 | 2 | | |
  70. Module Width (mm) | 133.5 | 133.5 | | |
  71. Reference Raw Card Used | Raw Card A Rev. 0 | Raw Card A Rev. 0 | | |
  72. DRAM Manufacture | | | | |
  73. | | | | |
  74. XMP Attributes | | | | |
  75. XMP Revision | 1.3 | 1.3 | | |
  76. Enthusiast / Certified Profile | | | | |
  77. Module voltage | 1.50V | 1.50V | | |
  78. Clock speed (MHz) | 934 | 934 | | |
  79. Transfer Speed (MHz) | DDR3-1867 | DDR3-1867 | | |
  80. Bandwidth (MB/s) | PC3-14900 | PC3-14900 | | |
  81. Minimum clock cycle time, tCK (ns) | 1.071 | 1.071 | | |
  82. Supported CAS latencies | 5 6 7 8 9 10 | 5 6 7 8 9 10 | | |
  83. Minimum CAS latency time, tAA (ns) | 10.710 | 10.710 | | |
  84. Minimum RAS to CAS delay time, tRCD (ns) | 11.781 | 11.781 | | |
  85. Minimum row precharge time, tRP (ns) | 10.710 | 10.710 | | |
  86. Minimum active to precharge time, tRAS (ns) | 32.125 | 32.125 | | |
  87. Supported timing at highest clock speed | 10-11-10-30 | 10-11-10-30 | | |
  88. Minimum Row Active to Row Active Delay, tRRD (ns) | 5.000 | 5.000 | | |
  89. Minimum Active to Auto-Refresh Delay, tRC (ns) | 42.840 | 42.840 | | |
  90. Minimum Recovery Delay, tRFC (ns) | 260.000 | 260.000 | | |
  91. Minimum Write Recovery time, tWR (ns) | 15.000 | 15.000 | | |
  92. Minimum Write to Read CMD Delay, tWTR (ns) | 7.500 | 7.500 | | |
  93. Minimum Read to Pre-charge CMD Delay, tRTP (ns) | 7.500 | 7.500 | | |
  94. Minimum Four Activate Window Delay, tFAW (ns) | 27.000 | 27.000 | | |
  95. Maximum Average Periodic Refresh Interval, tREFI (us) | 7.875 | 7.875 | | |
  96. Write to Read CMD Turn-around Time Optimizations | No adjustment | No adjustment | | |
  97. Read to Write CMD Turn-around Time Optimizations | No adjustment | No adjustment | | |
  98. Back 2 Back CMD Turn-around Time Optimizations | No adjustment | No adjustment | | |
  99. System CMD Rate Mode | 2T | 2T | | |
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