Gold Ram

Gold Ram:

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Memory Summary For DADSPC

Number of Memory Devices: 2 Total Physical Memory: 2943 MB (4096 MB)
                Total Available Physical Memory: 1764 MB
                Memory Load: 40%

Item    Slot #1 Slot #2 Slot #3 Slot #4
Ram Type    DDR2    DDR2    Not Populated   Not Populated
Maximum Clock Speed (MHz)   400 (JEDEC)     400 (JEDEC)
Maximum Transfer Speed (MHz)    DDR2-800    DDR2-800
Maximum Bandwidth (MB/s)    PC2-6400    PC2-6400
Memory Capacity (MB)    2048    2048
Jedec Manufacture Name  OCZ     OCZ
Search Amazon.com   Search!     Search!
SPD Revision    1.0     1.0
Registered  No  No
ECC     No  No
DIMM Slot #     1   2
Manufactured
Module Part #   OCZ2G8002G  OCZ2G8002G
Module Revision     0x0     0x0
Module Serial #     0x0     0x0
Module Manufacturing Location   2   2
# of Row Addressing Bits    14  14
# of Column Addressing Bits     10  10
# of Banks  8   8
# of Ranks  2   2
Device Width in Bits    8   8
Bus Width in Bits   64  64
Module Voltage  SSTL 1.8V   SSTL 1.8V
CAS Latencies Supported     3 4 5   3 4 5
Timings @ Max Frequency (JEDEC)     5-5-5-18    5-5-5-18
Maximum frequency (MHz)     400     400
Maximum Transfer Speed (MHz)    DDR2-800    DDR2-800
Maximum Bandwidth (MB/s)    PC2-6400    PC2-6400
Minimum Clock Cycle Time, tCK (ns)  2.500   2.500
Minimum CAS Latency Time, tAA (ns)  12.500  12.500
Minimum RAS to CAS Delay, tRCD (ns)     12.500  12.500
Minimum Row Precharge Time, tRP (ns)    12.500  12.500
Minimum Active to Precharge Time, tRAS (ns)     45.000  45.000
Minimum Row Active to Row Active Delay, tRRD (ns)   7.500   7.500
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns)  60.000  60.000
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns)   112.500     112.500

DDR2 Specific SPD Attributes

Data Access Time from Clock, tAC (ns)   0.400   0.400
Clock Cycle Time at Medium CAS Latency (ns)     3.000   3.000
Data Access Time at Medium CAS Latency (ns)     0.500   0.500
Clock Cycle Time at Short CAS Latency (ns)  3.750   3.750
Data Access Time at Short CAS Latency (ns)  0.600   0.600
Maximum Clock Cycle Time (ns)   8.000   8.000
Write Recover Time, tWR (ns)    15.000  15.000
Internal Write to Read Command Delay, tWTR (ns)     7.500   7.500
Internal Read to Precharge Command Delay, tRTP (ns)     7.500   7.500
Address/Command Setup Time Before Clock, tIS (ns)   0.170   0.170
Address/Command Hold Time After Clock, tIH (ns)     0.250   0.250
Data Input Setup Time Before Strobe, tDS (ns)   0.050   0.050
Data Input Hold Time After Strobe, tDH (ns)     0.120   0.120
Maximum Skew Between DQS and DQ Signals (ns)    0.200   0.200
Maximum Read Data hold Skew Factor (ns)     0.240   0.240
PLL Relock Time (ns)    0.000   0.000
DRAM Package Type   Planar  Planar
Burst Lengths Supported     4 8     4 8
Refresh Rate    Reduced (7.8us)     Reduced (7.8us)
# of PLLS on DIMM   0   0
FET Switch External Enable  No  No
Analysis Probe Installed    No  No
Weak Driver Supported   Yes     Yes
50 Ohm ODT Supported    Yes     Yes
Partial Array Self Refresh Supported    Yes     Yes
Module Type     UDIMM   UDIMM
Module Height (mm)  30.0    30.0