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Sharlikran

Black Ram

May 26th, 2017
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  1. Black Ram
  2.  
  3. RAMMon v1.0 Build: 1016 built with SysInfo v1.0 Build: 1121
  4. PassMark (R) Software - www.passmark.com
  5. Memory Summary For DADSPC
  6.  
  7. Number of Memory Devices: 2 Total Physical Memory: 2943 MB (4096 MB)
  8. Total Available Physical Memory: 1332 MB
  9. Memory Load: 54%
  10.  
  11. Item Slot #1 Slot #2 Slot #3 Slot #4
  12. Ram Type DDR2 DDR2 Not Populated Not Populated
  13. Maximum Clock Speed (MHz) 400 (JEDEC) 400 (JEDEC)
  14. Maximum Transfer Speed (MHz) DDR2-800 DDR2-800
  15. Maximum Bandwidth (MB/s) PC2-6400 PC2-6400
  16. Memory Capacity (MB) 2048 2048
  17. Jedec Manufacture Name Crucial Technology Crucial Technology
  18. Search Amazon.com Search! Search!
  19. SPD Revision 1.2 1.2
  20. Registered No No
  21. ECC No No
  22. DIMM Slot # 1 2
  23. Manufactured Week 165 of Year 2165 Week 165 of Year 2165
  24. Module Part # BL25664AA80E.16FH BL25664AA80E.16FH
  25. Module Revision 0xFFFF 0xFFFF
  26. Module Serial # 0x8106D429 0x8106D42A
  27. Module Manufacturing Location 255 255
  28. # of Row Addressing Bits 14 14
  29. # of Column Addressing Bits 10 10
  30. # of Banks 8 8
  31. # of Ranks 2 2
  32. Device Width in Bits 8 8
  33. Bus Width in Bits 64 64
  34. Module Voltage SSTL 1.8V SSTL 1.8V
  35. CAS Latencies Supported 4 5 4 5
  36. Timings @ Max Frequency (JEDEC) 5-5-5-18 5-5-5-18
  37. Maximum frequency (MHz) 400 400
  38. Maximum Transfer Speed (MHz) DDR2-800 DDR2-800
  39. Maximum Bandwidth (MB/s) PC2-6400 PC2-6400
  40. Minimum Clock Cycle Time, tCK (ns) 2.500 2.500
  41. Minimum CAS Latency Time, tAA (ns) 12.500 12.500
  42. Minimum RAS to CAS Delay, tRCD (ns) 12.500 12.500
  43. Minimum Row Precharge Time, tRP (ns) 12.500 12.500
  44. Minimum Active to Precharge Time, tRAS (ns) 45.000 45.000
  45. Minimum Row Active to Row Active Delay, tRRD (ns) 7.500 7.500
  46. Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns) 57.500 57.500
  47. Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns) 127.500 127.500
  48.  
  49. DDR2 Specific SPD Attributes
  50.  
  51. Data Access Time from Clock, tAC (ns) 0.400 0.400
  52. Clock Cycle Time at Medium CAS Latency (ns) 3.000 3.000
  53. Data Access Time at Medium CAS Latency (ns) 0.450 0.450
  54. Clock Cycle Time at Short CAS Latency (ns) 3.750 3.750
  55. Data Access Time at Short CAS Latency (ns) 0.500 0.500
  56. Maximum Clock Cycle Time (ns) 8.000 8.000
  57. Write Recover Time, tWR (ns) 15.000 15.000
  58. Internal Write to Read Command Delay, tWTR (ns) 7.500 7.500
  59. Internal Read to Precharge Command Delay, tRTP (ns) 7.500 7.500
  60. Address/Command Setup Time Before Clock, tIS (ns) 0.170 0.170
  61. Address/Command Hold Time After Clock, tIH (ns) 0.250 0.250
  62. Data Input Setup Time Before Strobe, tDS (ns) 0.050 0.050
  63. Data Input Hold Time After Strobe, tDH (ns) 0.120 0.120
  64. Maximum Skew Between DQS and DQ Signals (ns) 0.200 0.200
  65. Maximum Read Data hold Skew Factor (ns) 0.240 0.240
  66. PLL Relock Time (ns) 0.000 0.000
  67. DRAM Package Type Planar Planar
  68. Burst Lengths Supported 4 8 4 8
  69. Refresh Rate Reduced (7.8us) Reduced (7.8us)
  70. # of PLLS on DIMM 0 0
  71. FET Switch External Enable No No
  72. Analysis Probe Installed No No
  73. Weak Driver Supported Yes Yes
  74. 50 Ohm ODT Supported Yes Yes
  75. Partial Array Self Refresh Supported No No
  76. Module Type UDIMM UDIMM
  77. Module Height (mm) 30.0 30.0
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