Guest User

Untitled

a guest
Aug 5th, 2019
225
0
Never
Not a member of Pastebin yet? Sign Up, it unlocks many cool features!
text 29.22 KB | None | 0 0
  1. HWiNFO64 Version 6.10-3880
  2.  
  3. Central Processor(s) ------------------------------------------------------
  4.  
  5. [CPU Unit Count]
  6. Number Of Processor Packages (Physical): 1
  7. Number Of Processor Cores: 4
  8. Number Of Logical Processors: 8
  9.  
  10. Intel Core i7-920 ---------------------------------------------------------
  11.  
  12. [General Information]
  13. Processor Name: Intel Core i7-920
  14. Original Processor Frequency: 2666.7 MHz
  15. Original Processor Frequency [MHz]: 2667
  16. CPU ID: 000106A4
  17. CPU Brand Name: Intel(R) Core(TM) i7 CPU 920 @ 2.67GHz
  18. CPU Vendor: GenuineIntel
  19. CPU Stepping: C0/C1
  20. CPU Code Name: Bloomfield
  21. CPU Technology: 45 nm
  22. CPU S-Spec: SLBCH
  23. CPU Thermal Design Power (TDP): 130.0 W
  24. CPU Thermal Design Current (TDC): 110.0 A
  25. CPU Max. Case Temperature (Tcase_max): 67.9 °C
  26. CPU Max. Junction Temperature (Tj,max): 100 °C
  27. CPU Type: Production Unit
  28. CPU Platform: Socket B1 (LGA1366 FC-LGA6)
  29. Microcode Update Revision: 12
  30. Number of CPU Cores: 4
  31. Number of Logical CPUs: 8
  32.  
  33. Motherboard ---------------------------------------------------------------
  34.  
  35. [Computer]
  36. Computer Brand Name: DELL Studio XPS 435MT
  37. [Motherboard]
  38. Motherboard Model: DELL 0R849J
  39. Motherboard Chipset: Intel X58 (Tylersburg 36S) + ICH10R
  40. Motherboard Slots: 3xPCI Express x1, 1xPCI Express x4, 2xPCI Express x16
  41. PCI Express Version Supported: v2.0
  42. USB Version Supported: v2.0
  43. [ICH10 Features]
  44. Intel AMT Support: Not Supported
  45. SATA RAID 0/1/5/10: Supported
  46. [BIOS]
  47. BIOS Manufacturer: American Megatrends
  48. BIOS Date: 12/21/2009
  49. BIOS Version: 1.1.4
  50. UEFI BIOS: Not Capable
  51. Super-IO/LPC Chip: ITE IT8720F/CX
  52.  
  53. Memory Controller ---------------------------------------------------------
  54.  
  55. Error Detecting Method: 64-bit ECC
  56. Error Correction: None
  57. Supported Interleave: 1-Way
  58. Current Interleave: 1-Way
  59. Max. Memory Module Size: 2048 MBytes
  60. Supported Memory Speed: 70 ns, 60 ns
  61. Supported Memory Type: DIMM, SDRAM
  62. Supported Memory Voltage: 3.3 V
  63. Associated Memory Slots: 6
  64.  
  65. DIMM1 ---------------------------------------------------------------------
  66.  
  67. Socket Designation: DIMM1
  68. Memory Type:
  69. Memory Speed: Unknown
  70. Installed size: Not installed
  71. Enabled size: Not installed
  72.  
  73. DIMM2 ---------------------------------------------------------------------
  74.  
  75. Socket Designation: DIMM2
  76. Memory Type:
  77. Memory Speed: Unknown
  78. Installed size: Not installed
  79. Enabled size: Not installed
  80.  
  81. DIMM3 ---------------------------------------------------------------------
  82.  
  83. Socket Designation: DIMM3
  84. Memory Type:
  85. Memory Speed: Unknown
  86. Installed size: Not installed
  87. Enabled size: Not installed
  88.  
  89. DIMM4 ---------------------------------------------------------------------
  90.  
  91. Socket Designation: DIMM4
  92. Memory Type:
  93. Memory Speed: Unknown
  94. Installed size: Not installed
  95. Enabled size: Not installed
  96.  
  97. DIMM5 ---------------------------------------------------------------------
  98.  
  99. Socket Designation: DIMM5
  100. Memory Type:
  101. Memory Speed: Unknown
  102. Installed size: Not installed
  103. Enabled size: Not installed
  104.  
  105. DIMM6 ---------------------------------------------------------------------
  106.  
  107. Socket Designation: DIMM6
  108. Memory Type:
  109. Memory Speed: Unknown
  110. Installed size: Not installed
  111. Enabled size: Not installed
  112.  
  113. Physical Memory Array -----------------------------------------------------
  114.  
  115. Array Location: System board
  116. Array Use: System memory
  117. Error Detecting Method: None
  118. Memory Capacity: 12 GBytes
  119. Memory Devices: 6
  120.  
  121. Memory Array Mapped Address -----------------------------------------------
  122.  
  123. Starting Address: 00000000
  124. Ending Address: 00000000
  125. Partition Width: 1
  126.  
  127. Memory Device -------------------------------------------------------------
  128.  
  129. Total Width: 64 bits
  130. Data Width: 64 bits
  131. Device Size: 0 MBytes
  132. Device Form Factor: DIMM
  133. Device Locator: DIMM1
  134. Bank Locator: Unknown
  135. Device Type: Unknown
  136. Device Type Detail: FP, Static column, Pseudo-static, RAMBUS
  137. Memory Speed: 1066 MHz
  138. Manufacturer: Hyundai
  139. Serial Number: 00002A30
  140. Part Number: HMT112U6AFP8C-G7
  141. Asset Tag: 010848
  142.  
  143. Memory Device Mapped Address ----------------------------------------------
  144.  
  145. Starting Address: 00000000
  146. Ending Address: 00000000
  147. Partition Row Position: 1
  148. Interleave Position: Non-interleaved
  149. Interleave Data Depth: 2
  150.  
  151. Memory Device -------------------------------------------------------------
  152.  
  153. Total Width: 64 bits
  154. Data Width: 64 bits
  155. Device Size: 1024 MBytes
  156. Device Form Factor: DIMM
  157. Device Locator: DIMM2
  158. Bank Locator: Unknown
  159. Device Type: Unknown
  160. Device Type Detail: FP, Static column, Pseudo-static, RAMBUS
  161. Memory Speed: 1066 MHz
  162. Manufacturer: Hyundai
  163. Serial Number: 00001E30
  164. Part Number: HMT112U6AFP8C-G7
  165. Asset Tag: 010848
  166.  
  167. Memory Device Mapped Address ----------------------------------------------
  168.  
  169. Starting Address: 00000000
  170. Ending Address: 00000000
  171. Partition Row Position: 1
  172. Interleave Position: Non-interleaved
  173. Interleave Data Depth: 2
  174.  
  175. Memory Device -------------------------------------------------------------
  176.  
  177. Total Width: 64 bits
  178. Data Width: 64 bits
  179. Device Size: 0 MBytes
  180. Device Form Factor: DIMM
  181. Device Locator: DIMM3
  182. Bank Locator: Unknown
  183. Device Type: Unknown
  184. Device Type Detail: FP, Static column, Pseudo-static, RAMBUS
  185. Memory Speed: 1066 MHz
  186. Manufacturer: Hyundai
  187. Serial Number: 00002920
  188. Part Number: HMT112U6AFP8C-G7
  189. Asset Tag: 010848
  190.  
  191. Memory Device Mapped Address ----------------------------------------------
  192.  
  193. Starting Address: 00000000
  194. Ending Address: 00000000
  195. Partition Row Position: 1
  196. Interleave Position: Non-interleaved
  197. Interleave Data Depth: 2
  198.  
  199. Memory Device -------------------------------------------------------------
  200.  
  201. Total Width: 64 bits
  202. Data Width: 64 bits
  203. Device Size: 0 MBytes
  204. Device Form Factor: DIMM
  205. Device Locator: DIMM4
  206. Bank Locator: Unknown
  207. Device Type: Unknown
  208. Device Type Detail: FP, Static column, Pseudo-static, RAMBUS
  209. Memory Speed: 1333 MHz
  210. Manufacturer: Hyundai
  211. Serial Number: 6E1AC022
  212. Part Number: HMT112U6AFP8C-H9
  213. Asset Tag: 010912
  214.  
  215. Memory Device Mapped Address ----------------------------------------------
  216.  
  217. Starting Address: 00000000
  218. Ending Address: 00000000
  219. Partition Row Position: 1
  220. Interleave Position: Non-interleaved
  221. Interleave Data Depth: 2
  222.  
  223. Memory Device -------------------------------------------------------------
  224.  
  225. Total Width: 64 bits
  226. Data Width: 64 bits
  227. Device Size: 1024 MBytes
  228. Device Form Factor: DIMM
  229. Device Locator: DIMM5
  230. Bank Locator: Unknown
  231. Device Type: Unknown
  232. Device Type Detail: FP, Static column, Pseudo-static, RAMBUS
  233. Memory Speed: 1333 MHz
  234. Manufacturer: Hyundai
  235. Serial Number: 6D1A3022
  236. Part Number: HMT112U6AFP8C-H9
  237. Asset Tag: 010912
  238.  
  239. Memory Device Mapped Address ----------------------------------------------
  240.  
  241. Starting Address: 00000000
  242. Ending Address: 00000000
  243. Partition Row Position: 1
  244. Interleave Position: Non-interleaved
  245. Interleave Data Depth: 2
  246.  
  247. Memory Device -------------------------------------------------------------
  248.  
  249. Total Width: 64 bits
  250. Data Width: 64 bits
  251. Device Size: 0 MBytes
  252. Device Form Factor: DIMM
  253. Device Locator: DIMM6
  254. Bank Locator: Unknown
  255. Device Type: Unknown
  256. Device Type Detail: FP, Static column, Pseudo-static, RAMBUS
  257. Memory Speed: 1333 MHz
  258. Manufacturer: Hyundai
  259. Serial Number: 421A6022
  260. Part Number: HMT112U6AFP8C-H9
  261. Asset Tag: 010912
  262.  
  263. Memory Device Mapped Address ----------------------------------------------
  264.  
  265. Starting Address: 00000000
  266. Ending Address: 00000000
  267. Partition Row Position: 1
  268. Interleave Position: Non-interleaved
  269. Interleave Data Depth: 2
  270.  
  271. Memory --------------------------------------------------------------------
  272.  
  273. [General information]
  274. Total Memory Size: 6 GBytes
  275. Total Memory Size [MB]: 6144
  276. [Current Performance Settings]
  277. Maximum Supported Memory Clock: 533.3 MHz (4 : 1 ratio)
  278. Current Memory Clock: 532.1 MHz (4 : 1 ratio)
  279. Current Timing (tCAS-tRCD-tRP-tRAS): 7-7-7-20
  280. Memory Channels Supported: 3
  281. Memory Channels Active: 3
  282. Command Rate: 2T
  283. Read to Read Delay (tRD_RD) Same Rank: 4T
  284. Read to Read Delay (tRD_RD) Different Rank: 6T
  285. Read to Read Delay (tRD_RD) Different DIMM: 7T
  286. Write to Write Delay (tWR_WR) Same Rank: 4T
  287. Write to Write Delay (tWR_WR) Different Rank: 7T
  288. Write to Write Delay (tWR_WR) Different DIMM: 7T
  289. Read to Write Delay (tRD_WR) Same Rank: 9T
  290. Read to Write Delay (tRD_WR) Different Rank: 9T
  291. Read to Write Delay (tRD_WR) Different DIMM: 9T
  292. Write to Read Delay (tWR_RD) Same Rank (tWTR): 14T
  293. Write to Read Delay (tWR_RD) Different Rank: 6T
  294. Write to Read Delay (tWR_RD) Different DIMM: 6T
  295. Read to Precharge Delay (tRTP): 4T
  296. Write to Precharge Delay (tWTP): 18T
  297. Write Recovery Time (tWR): 7T
  298. RAS# to RAS# Delay (tRRD): 4T
  299. Refresh Cycle Time (tRFC): 59T
  300. Four Activate Window (tFAW): 20T
  301.  
  302. Row: 0 - 1 GB PC3-8500 DDR3 SDRAM SK Hynix HMT112U6AFP8C-G7 ---------------
  303.  
  304. [General Module Information]
  305. Module Number: 0
  306. Module Size: 1 GBytes
  307. Memory Type: DDR3 SDRAM
  308. Module Type: Unbuffered DIMM (UDIMM)
  309. Memory Speed: 533.3 MHz (DDR3-1066 / PC3-8500)
  310. Module Manufacturer: SK Hynix
  311. Module Part Number: HMT112U6AFP8C-G7
  312. Module Revision: 12366
  313. Module Serial Number: 10800
  314. Module Manufacturing Date: Year: 2008, Week: 48
  315. Module Manufacturing Location: 1
  316. SDRAM Manufacturer: SK Hynix
  317. Error Check/Correction: None
  318. [Module characteristics]
  319. Row Address Bits: 14
  320. Column Address Bits: 10
  321. Number Of Banks: 8
  322. Module Density: 1024 Mb
  323. Number Of Ranks: 1
  324. Device Width: 8 bits
  325. Bus Width: 64 bits
  326. Module Nominal Voltage (VDD): 1.5 V
  327. [Module timing]
  328. Minimum SDRAM Cycle Time (tCKmin): 1.875 ns
  329. CAS# Latencies Supported: 6, 7, 8
  330. Minimum CAS# Latency Time (tAAmin): 13.125 ns
  331. Minimum RAS# to CAS# Delay (tRCDmin): 13.125 ns
  332. Minimum Row Precharge Time (tRPmin): 13.125 ns
  333. Minimum Active to Precharge Time (tRASmin): 37.500 ns
  334. Supported Module Timing at 533.3 MHz: 7-7-7-20
  335. Supported Module Timing at 400.0 MHz: 6-6-6-15
  336. Minimum Write Recovery Time (tWRmin): 15.000 ns
  337. Minimum Row Active to Row Active Delay (tRRDmin): 7.500 ns
  338. Minimum Active to Active/Refresh Time (tRCmin): 50.625 ns
  339. Minimum Refresh Recovery Time Delay (tRFCmin): 110.000 ns
  340. Minimum Internal Write to Read Command Delay (tWTRmin): 7.500 ns
  341. Minimum Internal Read to Precharge Command Delay (tRTPmin): 7.500 ns
  342. Minimum Four Activate Window Delay Time (tFAWmin): 37.500 ns
  343. [Features]
  344. Partial Array Self Refresh (PASR): Not Supported
  345. On-die Thermal Sensor (ODTS) Readout: Supported
  346. Auto Self Refresh (ASR): Supported
  347. Extended Temperature 1X Refresh Rate: Not Supported
  348. Extended Temperature Range: Supported
  349. Module Temperature Sensor: Not Supported
  350. Pseudo Target Row Refresh (pTRR): Not Supported
  351. Module Nominal Height: 30 - 31 mm
  352. Module Maximum Thickness (Front): 1 - 2 mm
  353. Module Maximum Thickness (Back): 1 - 2 mm
  354.  
  355. Row: 1 - 1 GB PC3-10600 DDR3 SDRAM SK Hynix HMT112U6AFP8C-H9 --------------
  356.  
  357. [General Module Information]
  358. Module Number: 1
  359. Module Size: 1 GBytes
  360. Memory Type: DDR3 SDRAM
  361. Module Type: Unbuffered DIMM (UDIMM)
  362. Memory Speed: 666.7 MHz (DDR3-1333 / PC3-10600)
  363. Module Manufacturer: SK Hynix
  364. Module Part Number: HMT112U6AFP8C-H9
  365. Module Revision: 12366
  366. Module Serial Number: 1847246882
  367. Module Manufacturing Date: Year: 2009, Week: 12
  368. Module Manufacturing Location: 1
  369. SDRAM Manufacturer: SK Hynix
  370. Error Check/Correction: None
  371. [Module characteristics]
  372. Row Address Bits: 14
  373. Column Address Bits: 10
  374. Number Of Banks: 8
  375. Module Density: 1024 Mb
  376. Number Of Ranks: 1
  377. Device Width: 8 bits
  378. Bus Width: 64 bits
  379. Module Nominal Voltage (VDD): 1.5 V
  380. [Module timing]
  381. Minimum SDRAM Cycle Time (tCKmin): 1.500 ns
  382. CAS# Latencies Supported: 6, 7, 8, 9
  383. Minimum CAS# Latency Time (tAAmin): 13.125 ns
  384. Minimum RAS# to CAS# Delay (tRCDmin): 13.125 ns
  385. Minimum Row Precharge Time (tRPmin): 13.125 ns
  386. Minimum Active to Precharge Time (tRASmin): 36.000 ns
  387. Supported Module Timing at 666.7 MHz: 9-9-9-24
  388. Supported Module Timing at 533.3 MHz: 7-7-7-20
  389. Supported Module Timing at 400.0 MHz: 6-6-6-15
  390. Minimum Write Recovery Time (tWRmin): 15.000 ns
  391. Minimum Row Active to Row Active Delay (tRRDmin): 6.000 ns
  392. Minimum Active to Active/Refresh Time (tRCmin): 49.125 ns
  393. Minimum Refresh Recovery Time Delay (tRFCmin): 110.000 ns
  394. Minimum Internal Write to Read Command Delay (tWTRmin): 7.500 ns
  395. Minimum Internal Read to Precharge Command Delay (tRTPmin): 7.500 ns
  396. Minimum Four Activate Window Delay Time (tFAWmin): 30.000 ns
  397. [Features]
  398. Partial Array Self Refresh (PASR): Not Supported
  399. On-die Thermal Sensor (ODTS) Readout: Not Supported
  400. Auto Self Refresh (ASR): Supported
  401. Extended Temperature 1X Refresh Rate: Not Supported
  402. Extended Temperature Range: Supported
  403. Module Temperature Sensor: Not Supported
  404. Pseudo Target Row Refresh (pTRR): Not Supported
  405. Module Nominal Height: 29 - 30 mm
  406. Module Maximum Thickness (Front): 1 - 2 mm
  407. Module Maximum Thickness (Back): 1 - 2 mm
  408.  
  409. Row: 2 - 1 GB PC3-8500 DDR3 SDRAM SK Hynix HMT112U6AFP8C-G7 ---------------
  410.  
  411. [General Module Information]
  412. Module Number: 2
  413. Module Size: 1 GBytes
  414. Memory Type: DDR3 SDRAM
  415. Module Type: Unbuffered DIMM (UDIMM)
  416. Memory Speed: 533.3 MHz (DDR3-1066 / PC3-8500)
  417. Module Manufacturer: SK Hynix
  418. Module Part Number: HMT112U6AFP8C-G7
  419. Module Revision: 12366
  420. Module Serial Number: 7728
  421. Module Manufacturing Date: Year: 2008, Week: 48
  422. Module Manufacturing Location: 1
  423. SDRAM Manufacturer: SK Hynix
  424. Error Check/Correction: None
  425. [Module characteristics]
  426. Row Address Bits: 14
  427. Column Address Bits: 10
  428. Number Of Banks: 8
  429. Module Density: 1024 Mb
  430. Number Of Ranks: 1
  431. Device Width: 8 bits
  432. Bus Width: 64 bits
  433. Module Nominal Voltage (VDD): 1.5 V
  434. [Module timing]
  435. Minimum SDRAM Cycle Time (tCKmin): 1.875 ns
  436. CAS# Latencies Supported: 6, 7, 8
  437. Minimum CAS# Latency Time (tAAmin): 13.125 ns
  438. Minimum RAS# to CAS# Delay (tRCDmin): 13.125 ns
  439. Minimum Row Precharge Time (tRPmin): 13.125 ns
  440. Minimum Active to Precharge Time (tRASmin): 37.500 ns
  441. Supported Module Timing at 533.3 MHz: 7-7-7-20
  442. Supported Module Timing at 400.0 MHz: 6-6-6-15
  443. Minimum Write Recovery Time (tWRmin): 15.000 ns
  444. Minimum Row Active to Row Active Delay (tRRDmin): 7.500 ns
  445. Minimum Active to Active/Refresh Time (tRCmin): 50.625 ns
  446. Minimum Refresh Recovery Time Delay (tRFCmin): 110.000 ns
  447. Minimum Internal Write to Read Command Delay (tWTRmin): 7.500 ns
  448. Minimum Internal Read to Precharge Command Delay (tRTPmin): 7.500 ns
  449. Minimum Four Activate Window Delay Time (tFAWmin): 37.500 ns
  450. [Features]
  451. Partial Array Self Refresh (PASR): Not Supported
  452. On-die Thermal Sensor (ODTS) Readout: Supported
  453. Auto Self Refresh (ASR): Supported
  454. Extended Temperature 1X Refresh Rate: Not Supported
  455. Extended Temperature Range: Supported
  456. Module Temperature Sensor: Not Supported
  457. Pseudo Target Row Refresh (pTRR): Not Supported
  458. Module Nominal Height: 30 - 31 mm
  459. Module Maximum Thickness (Front): 1 - 2 mm
  460. Module Maximum Thickness (Back): 1 - 2 mm
  461.  
  462. Row: 3 - 1 GB PC3-10600 DDR3 SDRAM SK Hynix HMT112U6AFP8C-H9 --------------
  463.  
  464. [General Module Information]
  465. Module Number: 3
  466. Module Size: 1 GBytes
  467. Memory Type: DDR3 SDRAM
  468. Module Type: Unbuffered DIMM (UDIMM)
  469. Memory Speed: 666.7 MHz (DDR3-1333 / PC3-10600)
  470. Module Manufacturer: SK Hynix
  471. Module Part Number: HMT112U6AFP8C-H9
  472. Module Revision: 12366
  473. Module Serial Number: 1830432802
  474. Module Manufacturing Date: Year: 2009, Week: 12
  475. Module Manufacturing Location: 1
  476. SDRAM Manufacturer: SK Hynix
  477. Error Check/Correction: None
  478. [Module characteristics]
  479. Row Address Bits: 14
  480. Column Address Bits: 10
  481. Number Of Banks: 8
  482. Module Density: 1024 Mb
  483. Number Of Ranks: 1
  484. Device Width: 8 bits
  485. Bus Width: 64 bits
  486. Module Nominal Voltage (VDD): 1.5 V
  487. [Module timing]
  488. Minimum SDRAM Cycle Time (tCKmin): 1.500 ns
  489. CAS# Latencies Supported: 6, 7, 8, 9
  490. Minimum CAS# Latency Time (tAAmin): 13.125 ns
  491. Minimum RAS# to CAS# Delay (tRCDmin): 13.125 ns
  492. Minimum Row Precharge Time (tRPmin): 13.125 ns
  493. Minimum Active to Precharge Time (tRASmin): 36.000 ns
  494. Supported Module Timing at 666.7 MHz: 9-9-9-24
  495. Supported Module Timing at 533.3 MHz: 7-7-7-20
  496. Supported Module Timing at 400.0 MHz: 6-6-6-15
  497. Minimum Write Recovery Time (tWRmin): 15.000 ns
  498. Minimum Row Active to Row Active Delay (tRRDmin): 6.000 ns
  499. Minimum Active to Active/Refresh Time (tRCmin): 49.125 ns
  500. Minimum Refresh Recovery Time Delay (tRFCmin): 110.000 ns
  501. Minimum Internal Write to Read Command Delay (tWTRmin): 7.500 ns
  502. Minimum Internal Read to Precharge Command Delay (tRTPmin): 7.500 ns
  503. Minimum Four Activate Window Delay Time (tFAWmin): 30.000 ns
  504. [Features]
  505. Partial Array Self Refresh (PASR): Not Supported
  506. On-die Thermal Sensor (ODTS) Readout: Not Supported
  507. Auto Self Refresh (ASR): Supported
  508. Extended Temperature 1X Refresh Rate: Not Supported
  509. Extended Temperature Range: Supported
  510. Module Temperature Sensor: Not Supported
  511. Pseudo Target Row Refresh (pTRR): Not Supported
  512. Module Nominal Height: 29 - 30 mm
  513. Module Maximum Thickness (Front): 1 - 2 mm
  514. Module Maximum Thickness (Back): 1 - 2 mm
  515.  
  516. Row: 4 - 1 GB PC3-8500 DDR3 SDRAM SK Hynix HMT112U6AFP8C-G7 ---------------
  517.  
  518. [General Module Information]
  519. Module Number: 4
  520. Module Size: 1 GBytes
  521. Memory Type: DDR3 SDRAM
  522. Module Type: Unbuffered DIMM (UDIMM)
  523. Memory Speed: 533.3 MHz (DDR3-1066 / PC3-8500)
  524. Module Manufacturer: SK Hynix
  525. Module Part Number: HMT112U6AFP8C-G7
  526. Module Revision: 12366
  527. Module Serial Number: 10528
  528. Module Manufacturing Date: Year: 2008, Week: 48
  529. Module Manufacturing Location: 1
  530. SDRAM Manufacturer: SK Hynix
  531. Error Check/Correction: None
  532. [Module characteristics]
  533. Row Address Bits: 14
  534. Column Address Bits: 10
  535. Number Of Banks: 8
  536. Module Density: 1024 Mb
  537. Number Of Ranks: 1
  538. Device Width: 8 bits
  539. Bus Width: 64 bits
  540. Module Nominal Voltage (VDD): 1.5 V
  541. [Module timing]
  542. Minimum SDRAM Cycle Time (tCKmin): 1.875 ns
  543. CAS# Latencies Supported: 6, 7, 8
  544. Minimum CAS# Latency Time (tAAmin): 13.125 ns
  545. Minimum RAS# to CAS# Delay (tRCDmin): 13.125 ns
  546. Minimum Row Precharge Time (tRPmin): 13.125 ns
  547. Minimum Active to Precharge Time (tRASmin): 37.500 ns
  548. Supported Module Timing at 533.3 MHz: 7-7-7-20
  549. Supported Module Timing at 400.0 MHz: 6-6-6-15
  550. Minimum Write Recovery Time (tWRmin): 15.000 ns
  551. Minimum Row Active to Row Active Delay (tRRDmin): 7.500 ns
  552. Minimum Active to Active/Refresh Time (tRCmin): 50.625 ns
  553. Minimum Refresh Recovery Time Delay (tRFCmin): 110.000 ns
  554. Minimum Internal Write to Read Command Delay (tWTRmin): 7.500 ns
  555. Minimum Internal Read to Precharge Command Delay (tRTPmin): 7.500 ns
  556. Minimum Four Activate Window Delay Time (tFAWmin): 37.500 ns
  557. [Features]
  558. Partial Array Self Refresh (PASR): Not Supported
  559. On-die Thermal Sensor (ODTS) Readout: Supported
  560. Auto Self Refresh (ASR): Supported
  561. Extended Temperature 1X Refresh Rate: Not Supported
  562. Extended Temperature Range: Supported
  563. Module Temperature Sensor: Not Supported
  564. Pseudo Target Row Refresh (pTRR): Not Supported
  565. Module Nominal Height: 30 - 31 mm
  566. Module Maximum Thickness (Front): 1 - 2 mm
  567. Module Maximum Thickness (Back): 1 - 2 mm
  568.  
  569. Row: 5 - 1 GB PC3-10600 DDR3 SDRAM SK Hynix HMT112U6AFP8C-H9 --------------
  570.  
  571. [General Module Information]
  572. Module Number: 5
  573. Module Size: 1 GBytes
  574. Memory Type: DDR3 SDRAM
  575. Module Type: Unbuffered DIMM (UDIMM)
  576. Memory Speed: 666.7 MHz (DDR3-1333 / PC3-10600)
  577. Module Manufacturer: SK Hynix
  578. Module Part Number: HMT112U6AFP8C-H9
  579. Module Revision: 12366
  580. Module Serial Number: 1109024802
  581. Module Manufacturing Date: Year: 2009, Week: 12
  582. Module Manufacturing Location: 1
  583. SDRAM Manufacturer: SK Hynix
  584. Error Check/Correction: None
  585. [Module characteristics]
  586. Row Address Bits: 14
  587. Column Address Bits: 10
  588. Number Of Banks: 8
  589. Module Density: 1024 Mb
  590. Number Of Ranks: 1
  591. Device Width: 8 bits
  592. Bus Width: 64 bits
  593. Module Nominal Voltage (VDD): 1.5 V
  594. [Module timing]
  595. Minimum SDRAM Cycle Time (tCKmin): 1.500 ns
  596. CAS# Latencies Supported: 6, 7, 8, 9
  597. Minimum CAS# Latency Time (tAAmin): 13.125 ns
  598. Minimum RAS# to CAS# Delay (tRCDmin): 13.125 ns
  599. Minimum Row Precharge Time (tRPmin): 13.125 ns
  600. Minimum Active to Precharge Time (tRASmin): 36.000 ns
  601. Supported Module Timing at 666.7 MHz: 9-9-9-24
  602. Supported Module Timing at 533.3 MHz: 7-7-7-20
  603. Supported Module Timing at 400.0 MHz: 6-6-6-15
  604. Minimum Write Recovery Time (tWRmin): 15.000 ns
  605. Minimum Row Active to Row Active Delay (tRRDmin): 6.000 ns
  606. Minimum Active to Active/Refresh Time (tRCmin): 49.125 ns
  607. Minimum Refresh Recovery Time Delay (tRFCmin): 110.000 ns
  608. Minimum Internal Write to Read Command Delay (tWTRmin): 7.500 ns
  609. Minimum Internal Read to Precharge Command Delay (tRTPmin): 7.500 ns
  610. Minimum Four Activate Window Delay Time (tFAWmin): 30.000 ns
  611. [Features]
  612. Partial Array Self Refresh (PASR): Not Supported
  613. On-die Thermal Sensor (ODTS) Readout: Not Supported
  614. Auto Self Refresh (ASR): Supported
  615. Extended Temperature 1X Refresh Rate: Not Supported
  616. Extended Temperature Range: Supported
  617. Module Temperature Sensor: Not Supported
  618. Pseudo Target Row Refresh (pTRR): Not Supported
  619. Module Nominal Height: 29 - 30 mm
  620. Module Maximum Thickness (Front): 1 - 2 mm
  621. Module Maximum Thickness (Back): 1 - 2 mm
Advertisement
Add Comment
Please, Sign In to add comment