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- HWiNFO64 Version 6.10-3880
- Central Processor(s) ------------------------------------------------------
- [CPU Unit Count]
- Number Of Processor Packages (Physical): 1
- Number Of Processor Cores: 4
- Number Of Logical Processors: 8
- Intel Core i7-920 ---------------------------------------------------------
- [General Information]
- Processor Name: Intel Core i7-920
- Original Processor Frequency: 2666.7 MHz
- Original Processor Frequency [MHz]: 2667
- CPU ID: 000106A4
- CPU Brand Name: Intel(R) Core(TM) i7 CPU 920 @ 2.67GHz
- CPU Vendor: GenuineIntel
- CPU Stepping: C0/C1
- CPU Code Name: Bloomfield
- CPU Technology: 45 nm
- CPU S-Spec: SLBCH
- CPU Thermal Design Power (TDP): 130.0 W
- CPU Thermal Design Current (TDC): 110.0 A
- CPU Max. Case Temperature (Tcase_max): 67.9 °C
- CPU Max. Junction Temperature (Tj,max): 100 °C
- CPU Type: Production Unit
- CPU Platform: Socket B1 (LGA1366 FC-LGA6)
- Microcode Update Revision: 12
- Number of CPU Cores: 4
- Number of Logical CPUs: 8
- Motherboard ---------------------------------------------------------------
- [Computer]
- Computer Brand Name: DELL Studio XPS 435MT
- [Motherboard]
- Motherboard Model: DELL 0R849J
- Motherboard Chipset: Intel X58 (Tylersburg 36S) + ICH10R
- Motherboard Slots: 3xPCI Express x1, 1xPCI Express x4, 2xPCI Express x16
- PCI Express Version Supported: v2.0
- USB Version Supported: v2.0
- [ICH10 Features]
- Intel AMT Support: Not Supported
- SATA RAID 0/1/5/10: Supported
- [BIOS]
- BIOS Manufacturer: American Megatrends
- BIOS Date: 12/21/2009
- BIOS Version: 1.1.4
- UEFI BIOS: Not Capable
- Super-IO/LPC Chip: ITE IT8720F/CX
- Memory Controller ---------------------------------------------------------
- Error Detecting Method: 64-bit ECC
- Error Correction: None
- Supported Interleave: 1-Way
- Current Interleave: 1-Way
- Max. Memory Module Size: 2048 MBytes
- Supported Memory Speed: 70 ns, 60 ns
- Supported Memory Type: DIMM, SDRAM
- Supported Memory Voltage: 3.3 V
- Associated Memory Slots: 6
- DIMM1 ---------------------------------------------------------------------
- Socket Designation: DIMM1
- Memory Type:
- Memory Speed: Unknown
- Installed size: Not installed
- Enabled size: Not installed
- DIMM2 ---------------------------------------------------------------------
- Socket Designation: DIMM2
- Memory Type:
- Memory Speed: Unknown
- Installed size: Not installed
- Enabled size: Not installed
- DIMM3 ---------------------------------------------------------------------
- Socket Designation: DIMM3
- Memory Type:
- Memory Speed: Unknown
- Installed size: Not installed
- Enabled size: Not installed
- DIMM4 ---------------------------------------------------------------------
- Socket Designation: DIMM4
- Memory Type:
- Memory Speed: Unknown
- Installed size: Not installed
- Enabled size: Not installed
- DIMM5 ---------------------------------------------------------------------
- Socket Designation: DIMM5
- Memory Type:
- Memory Speed: Unknown
- Installed size: Not installed
- Enabled size: Not installed
- DIMM6 ---------------------------------------------------------------------
- Socket Designation: DIMM6
- Memory Type:
- Memory Speed: Unknown
- Installed size: Not installed
- Enabled size: Not installed
- Physical Memory Array -----------------------------------------------------
- Array Location: System board
- Array Use: System memory
- Error Detecting Method: None
- Memory Capacity: 12 GBytes
- Memory Devices: 6
- Memory Array Mapped Address -----------------------------------------------
- Starting Address: 00000000
- Ending Address: 00000000
- Partition Width: 1
- Memory Device -------------------------------------------------------------
- Total Width: 64 bits
- Data Width: 64 bits
- Device Size: 0 MBytes
- Device Form Factor: DIMM
- Device Locator: DIMM1
- Bank Locator: Unknown
- Device Type: Unknown
- Device Type Detail: FP, Static column, Pseudo-static, RAMBUS
- Memory Speed: 1066 MHz
- Manufacturer: Hyundai
- Serial Number: 00002A30
- Part Number: HMT112U6AFP8C-G7
- Asset Tag: 010848
- Memory Device Mapped Address ----------------------------------------------
- Starting Address: 00000000
- Ending Address: 00000000
- Partition Row Position: 1
- Interleave Position: Non-interleaved
- Interleave Data Depth: 2
- Memory Device -------------------------------------------------------------
- Total Width: 64 bits
- Data Width: 64 bits
- Device Size: 1024 MBytes
- Device Form Factor: DIMM
- Device Locator: DIMM2
- Bank Locator: Unknown
- Device Type: Unknown
- Device Type Detail: FP, Static column, Pseudo-static, RAMBUS
- Memory Speed: 1066 MHz
- Manufacturer: Hyundai
- Serial Number: 00001E30
- Part Number: HMT112U6AFP8C-G7
- Asset Tag: 010848
- Memory Device Mapped Address ----------------------------------------------
- Starting Address: 00000000
- Ending Address: 00000000
- Partition Row Position: 1
- Interleave Position: Non-interleaved
- Interleave Data Depth: 2
- Memory Device -------------------------------------------------------------
- Total Width: 64 bits
- Data Width: 64 bits
- Device Size: 0 MBytes
- Device Form Factor: DIMM
- Device Locator: DIMM3
- Bank Locator: Unknown
- Device Type: Unknown
- Device Type Detail: FP, Static column, Pseudo-static, RAMBUS
- Memory Speed: 1066 MHz
- Manufacturer: Hyundai
- Serial Number: 00002920
- Part Number: HMT112U6AFP8C-G7
- Asset Tag: 010848
- Memory Device Mapped Address ----------------------------------------------
- Starting Address: 00000000
- Ending Address: 00000000
- Partition Row Position: 1
- Interleave Position: Non-interleaved
- Interleave Data Depth: 2
- Memory Device -------------------------------------------------------------
- Total Width: 64 bits
- Data Width: 64 bits
- Device Size: 0 MBytes
- Device Form Factor: DIMM
- Device Locator: DIMM4
- Bank Locator: Unknown
- Device Type: Unknown
- Device Type Detail: FP, Static column, Pseudo-static, RAMBUS
- Memory Speed: 1333 MHz
- Manufacturer: Hyundai
- Serial Number: 6E1AC022
- Part Number: HMT112U6AFP8C-H9
- Asset Tag: 010912
- Memory Device Mapped Address ----------------------------------------------
- Starting Address: 00000000
- Ending Address: 00000000
- Partition Row Position: 1
- Interleave Position: Non-interleaved
- Interleave Data Depth: 2
- Memory Device -------------------------------------------------------------
- Total Width: 64 bits
- Data Width: 64 bits
- Device Size: 1024 MBytes
- Device Form Factor: DIMM
- Device Locator: DIMM5
- Bank Locator: Unknown
- Device Type: Unknown
- Device Type Detail: FP, Static column, Pseudo-static, RAMBUS
- Memory Speed: 1333 MHz
- Manufacturer: Hyundai
- Serial Number: 6D1A3022
- Part Number: HMT112U6AFP8C-H9
- Asset Tag: 010912
- Memory Device Mapped Address ----------------------------------------------
- Starting Address: 00000000
- Ending Address: 00000000
- Partition Row Position: 1
- Interleave Position: Non-interleaved
- Interleave Data Depth: 2
- Memory Device -------------------------------------------------------------
- Total Width: 64 bits
- Data Width: 64 bits
- Device Size: 0 MBytes
- Device Form Factor: DIMM
- Device Locator: DIMM6
- Bank Locator: Unknown
- Device Type: Unknown
- Device Type Detail: FP, Static column, Pseudo-static, RAMBUS
- Memory Speed: 1333 MHz
- Manufacturer: Hyundai
- Serial Number: 421A6022
- Part Number: HMT112U6AFP8C-H9
- Asset Tag: 010912
- Memory Device Mapped Address ----------------------------------------------
- Starting Address: 00000000
- Ending Address: 00000000
- Partition Row Position: 1
- Interleave Position: Non-interleaved
- Interleave Data Depth: 2
- Memory --------------------------------------------------------------------
- [General information]
- Total Memory Size: 6 GBytes
- Total Memory Size [MB]: 6144
- [Current Performance Settings]
- Maximum Supported Memory Clock: 533.3 MHz (4 : 1 ratio)
- Current Memory Clock: 532.1 MHz (4 : 1 ratio)
- Current Timing (tCAS-tRCD-tRP-tRAS): 7-7-7-20
- Memory Channels Supported: 3
- Memory Channels Active: 3
- Command Rate: 2T
- Read to Read Delay (tRD_RD) Same Rank: 4T
- Read to Read Delay (tRD_RD) Different Rank: 6T
- Read to Read Delay (tRD_RD) Different DIMM: 7T
- Write to Write Delay (tWR_WR) Same Rank: 4T
- Write to Write Delay (tWR_WR) Different Rank: 7T
- Write to Write Delay (tWR_WR) Different DIMM: 7T
- Read to Write Delay (tRD_WR) Same Rank: 9T
- Read to Write Delay (tRD_WR) Different Rank: 9T
- Read to Write Delay (tRD_WR) Different DIMM: 9T
- Write to Read Delay (tWR_RD) Same Rank (tWTR): 14T
- Write to Read Delay (tWR_RD) Different Rank: 6T
- Write to Read Delay (tWR_RD) Different DIMM: 6T
- Read to Precharge Delay (tRTP): 4T
- Write to Precharge Delay (tWTP): 18T
- Write Recovery Time (tWR): 7T
- RAS# to RAS# Delay (tRRD): 4T
- Refresh Cycle Time (tRFC): 59T
- Four Activate Window (tFAW): 20T
- Row: 0 - 1 GB PC3-8500 DDR3 SDRAM SK Hynix HMT112U6AFP8C-G7 ---------------
- [General Module Information]
- Module Number: 0
- Module Size: 1 GBytes
- Memory Type: DDR3 SDRAM
- Module Type: Unbuffered DIMM (UDIMM)
- Memory Speed: 533.3 MHz (DDR3-1066 / PC3-8500)
- Module Manufacturer: SK Hynix
- Module Part Number: HMT112U6AFP8C-G7
- Module Revision: 12366
- Module Serial Number: 10800
- Module Manufacturing Date: Year: 2008, Week: 48
- Module Manufacturing Location: 1
- SDRAM Manufacturer: SK Hynix
- Error Check/Correction: None
- [Module characteristics]
- Row Address Bits: 14
- Column Address Bits: 10
- Number Of Banks: 8
- Module Density: 1024 Mb
- Number Of Ranks: 1
- Device Width: 8 bits
- Bus Width: 64 bits
- Module Nominal Voltage (VDD): 1.5 V
- [Module timing]
- Minimum SDRAM Cycle Time (tCKmin): 1.875 ns
- CAS# Latencies Supported: 6, 7, 8
- Minimum CAS# Latency Time (tAAmin): 13.125 ns
- Minimum RAS# to CAS# Delay (tRCDmin): 13.125 ns
- Minimum Row Precharge Time (tRPmin): 13.125 ns
- Minimum Active to Precharge Time (tRASmin): 37.500 ns
- Supported Module Timing at 533.3 MHz: 7-7-7-20
- Supported Module Timing at 400.0 MHz: 6-6-6-15
- Minimum Write Recovery Time (tWRmin): 15.000 ns
- Minimum Row Active to Row Active Delay (tRRDmin): 7.500 ns
- Minimum Active to Active/Refresh Time (tRCmin): 50.625 ns
- Minimum Refresh Recovery Time Delay (tRFCmin): 110.000 ns
- Minimum Internal Write to Read Command Delay (tWTRmin): 7.500 ns
- Minimum Internal Read to Precharge Command Delay (tRTPmin): 7.500 ns
- Minimum Four Activate Window Delay Time (tFAWmin): 37.500 ns
- [Features]
- Partial Array Self Refresh (PASR): Not Supported
- On-die Thermal Sensor (ODTS) Readout: Supported
- Auto Self Refresh (ASR): Supported
- Extended Temperature 1X Refresh Rate: Not Supported
- Extended Temperature Range: Supported
- Module Temperature Sensor: Not Supported
- Pseudo Target Row Refresh (pTRR): Not Supported
- Module Nominal Height: 30 - 31 mm
- Module Maximum Thickness (Front): 1 - 2 mm
- Module Maximum Thickness (Back): 1 - 2 mm
- Row: 1 - 1 GB PC3-10600 DDR3 SDRAM SK Hynix HMT112U6AFP8C-H9 --------------
- [General Module Information]
- Module Number: 1
- Module Size: 1 GBytes
- Memory Type: DDR3 SDRAM
- Module Type: Unbuffered DIMM (UDIMM)
- Memory Speed: 666.7 MHz (DDR3-1333 / PC3-10600)
- Module Manufacturer: SK Hynix
- Module Part Number: HMT112U6AFP8C-H9
- Module Revision: 12366
- Module Serial Number: 1847246882
- Module Manufacturing Date: Year: 2009, Week: 12
- Module Manufacturing Location: 1
- SDRAM Manufacturer: SK Hynix
- Error Check/Correction: None
- [Module characteristics]
- Row Address Bits: 14
- Column Address Bits: 10
- Number Of Banks: 8
- Module Density: 1024 Mb
- Number Of Ranks: 1
- Device Width: 8 bits
- Bus Width: 64 bits
- Module Nominal Voltage (VDD): 1.5 V
- [Module timing]
- Minimum SDRAM Cycle Time (tCKmin): 1.500 ns
- CAS# Latencies Supported: 6, 7, 8, 9
- Minimum CAS# Latency Time (tAAmin): 13.125 ns
- Minimum RAS# to CAS# Delay (tRCDmin): 13.125 ns
- Minimum Row Precharge Time (tRPmin): 13.125 ns
- Minimum Active to Precharge Time (tRASmin): 36.000 ns
- Supported Module Timing at 666.7 MHz: 9-9-9-24
- Supported Module Timing at 533.3 MHz: 7-7-7-20
- Supported Module Timing at 400.0 MHz: 6-6-6-15
- Minimum Write Recovery Time (tWRmin): 15.000 ns
- Minimum Row Active to Row Active Delay (tRRDmin): 6.000 ns
- Minimum Active to Active/Refresh Time (tRCmin): 49.125 ns
- Minimum Refresh Recovery Time Delay (tRFCmin): 110.000 ns
- Minimum Internal Write to Read Command Delay (tWTRmin): 7.500 ns
- Minimum Internal Read to Precharge Command Delay (tRTPmin): 7.500 ns
- Minimum Four Activate Window Delay Time (tFAWmin): 30.000 ns
- [Features]
- Partial Array Self Refresh (PASR): Not Supported
- On-die Thermal Sensor (ODTS) Readout: Not Supported
- Auto Self Refresh (ASR): Supported
- Extended Temperature 1X Refresh Rate: Not Supported
- Extended Temperature Range: Supported
- Module Temperature Sensor: Not Supported
- Pseudo Target Row Refresh (pTRR): Not Supported
- Module Nominal Height: 29 - 30 mm
- Module Maximum Thickness (Front): 1 - 2 mm
- Module Maximum Thickness (Back): 1 - 2 mm
- Row: 2 - 1 GB PC3-8500 DDR3 SDRAM SK Hynix HMT112U6AFP8C-G7 ---------------
- [General Module Information]
- Module Number: 2
- Module Size: 1 GBytes
- Memory Type: DDR3 SDRAM
- Module Type: Unbuffered DIMM (UDIMM)
- Memory Speed: 533.3 MHz (DDR3-1066 / PC3-8500)
- Module Manufacturer: SK Hynix
- Module Part Number: HMT112U6AFP8C-G7
- Module Revision: 12366
- Module Serial Number: 7728
- Module Manufacturing Date: Year: 2008, Week: 48
- Module Manufacturing Location: 1
- SDRAM Manufacturer: SK Hynix
- Error Check/Correction: None
- [Module characteristics]
- Row Address Bits: 14
- Column Address Bits: 10
- Number Of Banks: 8
- Module Density: 1024 Mb
- Number Of Ranks: 1
- Device Width: 8 bits
- Bus Width: 64 bits
- Module Nominal Voltage (VDD): 1.5 V
- [Module timing]
- Minimum SDRAM Cycle Time (tCKmin): 1.875 ns
- CAS# Latencies Supported: 6, 7, 8
- Minimum CAS# Latency Time (tAAmin): 13.125 ns
- Minimum RAS# to CAS# Delay (tRCDmin): 13.125 ns
- Minimum Row Precharge Time (tRPmin): 13.125 ns
- Minimum Active to Precharge Time (tRASmin): 37.500 ns
- Supported Module Timing at 533.3 MHz: 7-7-7-20
- Supported Module Timing at 400.0 MHz: 6-6-6-15
- Minimum Write Recovery Time (tWRmin): 15.000 ns
- Minimum Row Active to Row Active Delay (tRRDmin): 7.500 ns
- Minimum Active to Active/Refresh Time (tRCmin): 50.625 ns
- Minimum Refresh Recovery Time Delay (tRFCmin): 110.000 ns
- Minimum Internal Write to Read Command Delay (tWTRmin): 7.500 ns
- Minimum Internal Read to Precharge Command Delay (tRTPmin): 7.500 ns
- Minimum Four Activate Window Delay Time (tFAWmin): 37.500 ns
- [Features]
- Partial Array Self Refresh (PASR): Not Supported
- On-die Thermal Sensor (ODTS) Readout: Supported
- Auto Self Refresh (ASR): Supported
- Extended Temperature 1X Refresh Rate: Not Supported
- Extended Temperature Range: Supported
- Module Temperature Sensor: Not Supported
- Pseudo Target Row Refresh (pTRR): Not Supported
- Module Nominal Height: 30 - 31 mm
- Module Maximum Thickness (Front): 1 - 2 mm
- Module Maximum Thickness (Back): 1 - 2 mm
- Row: 3 - 1 GB PC3-10600 DDR3 SDRAM SK Hynix HMT112U6AFP8C-H9 --------------
- [General Module Information]
- Module Number: 3
- Module Size: 1 GBytes
- Memory Type: DDR3 SDRAM
- Module Type: Unbuffered DIMM (UDIMM)
- Memory Speed: 666.7 MHz (DDR3-1333 / PC3-10600)
- Module Manufacturer: SK Hynix
- Module Part Number: HMT112U6AFP8C-H9
- Module Revision: 12366
- Module Serial Number: 1830432802
- Module Manufacturing Date: Year: 2009, Week: 12
- Module Manufacturing Location: 1
- SDRAM Manufacturer: SK Hynix
- Error Check/Correction: None
- [Module characteristics]
- Row Address Bits: 14
- Column Address Bits: 10
- Number Of Banks: 8
- Module Density: 1024 Mb
- Number Of Ranks: 1
- Device Width: 8 bits
- Bus Width: 64 bits
- Module Nominal Voltage (VDD): 1.5 V
- [Module timing]
- Minimum SDRAM Cycle Time (tCKmin): 1.500 ns
- CAS# Latencies Supported: 6, 7, 8, 9
- Minimum CAS# Latency Time (tAAmin): 13.125 ns
- Minimum RAS# to CAS# Delay (tRCDmin): 13.125 ns
- Minimum Row Precharge Time (tRPmin): 13.125 ns
- Minimum Active to Precharge Time (tRASmin): 36.000 ns
- Supported Module Timing at 666.7 MHz: 9-9-9-24
- Supported Module Timing at 533.3 MHz: 7-7-7-20
- Supported Module Timing at 400.0 MHz: 6-6-6-15
- Minimum Write Recovery Time (tWRmin): 15.000 ns
- Minimum Row Active to Row Active Delay (tRRDmin): 6.000 ns
- Minimum Active to Active/Refresh Time (tRCmin): 49.125 ns
- Minimum Refresh Recovery Time Delay (tRFCmin): 110.000 ns
- Minimum Internal Write to Read Command Delay (tWTRmin): 7.500 ns
- Minimum Internal Read to Precharge Command Delay (tRTPmin): 7.500 ns
- Minimum Four Activate Window Delay Time (tFAWmin): 30.000 ns
- [Features]
- Partial Array Self Refresh (PASR): Not Supported
- On-die Thermal Sensor (ODTS) Readout: Not Supported
- Auto Self Refresh (ASR): Supported
- Extended Temperature 1X Refresh Rate: Not Supported
- Extended Temperature Range: Supported
- Module Temperature Sensor: Not Supported
- Pseudo Target Row Refresh (pTRR): Not Supported
- Module Nominal Height: 29 - 30 mm
- Module Maximum Thickness (Front): 1 - 2 mm
- Module Maximum Thickness (Back): 1 - 2 mm
- Row: 4 - 1 GB PC3-8500 DDR3 SDRAM SK Hynix HMT112U6AFP8C-G7 ---------------
- [General Module Information]
- Module Number: 4
- Module Size: 1 GBytes
- Memory Type: DDR3 SDRAM
- Module Type: Unbuffered DIMM (UDIMM)
- Memory Speed: 533.3 MHz (DDR3-1066 / PC3-8500)
- Module Manufacturer: SK Hynix
- Module Part Number: HMT112U6AFP8C-G7
- Module Revision: 12366
- Module Serial Number: 10528
- Module Manufacturing Date: Year: 2008, Week: 48
- Module Manufacturing Location: 1
- SDRAM Manufacturer: SK Hynix
- Error Check/Correction: None
- [Module characteristics]
- Row Address Bits: 14
- Column Address Bits: 10
- Number Of Banks: 8
- Module Density: 1024 Mb
- Number Of Ranks: 1
- Device Width: 8 bits
- Bus Width: 64 bits
- Module Nominal Voltage (VDD): 1.5 V
- [Module timing]
- Minimum SDRAM Cycle Time (tCKmin): 1.875 ns
- CAS# Latencies Supported: 6, 7, 8
- Minimum CAS# Latency Time (tAAmin): 13.125 ns
- Minimum RAS# to CAS# Delay (tRCDmin): 13.125 ns
- Minimum Row Precharge Time (tRPmin): 13.125 ns
- Minimum Active to Precharge Time (tRASmin): 37.500 ns
- Supported Module Timing at 533.3 MHz: 7-7-7-20
- Supported Module Timing at 400.0 MHz: 6-6-6-15
- Minimum Write Recovery Time (tWRmin): 15.000 ns
- Minimum Row Active to Row Active Delay (tRRDmin): 7.500 ns
- Minimum Active to Active/Refresh Time (tRCmin): 50.625 ns
- Minimum Refresh Recovery Time Delay (tRFCmin): 110.000 ns
- Minimum Internal Write to Read Command Delay (tWTRmin): 7.500 ns
- Minimum Internal Read to Precharge Command Delay (tRTPmin): 7.500 ns
- Minimum Four Activate Window Delay Time (tFAWmin): 37.500 ns
- [Features]
- Partial Array Self Refresh (PASR): Not Supported
- On-die Thermal Sensor (ODTS) Readout: Supported
- Auto Self Refresh (ASR): Supported
- Extended Temperature 1X Refresh Rate: Not Supported
- Extended Temperature Range: Supported
- Module Temperature Sensor: Not Supported
- Pseudo Target Row Refresh (pTRR): Not Supported
- Module Nominal Height: 30 - 31 mm
- Module Maximum Thickness (Front): 1 - 2 mm
- Module Maximum Thickness (Back): 1 - 2 mm
- Row: 5 - 1 GB PC3-10600 DDR3 SDRAM SK Hynix HMT112U6AFP8C-H9 --------------
- [General Module Information]
- Module Number: 5
- Module Size: 1 GBytes
- Memory Type: DDR3 SDRAM
- Module Type: Unbuffered DIMM (UDIMM)
- Memory Speed: 666.7 MHz (DDR3-1333 / PC3-10600)
- Module Manufacturer: SK Hynix
- Module Part Number: HMT112U6AFP8C-H9
- Module Revision: 12366
- Module Serial Number: 1109024802
- Module Manufacturing Date: Year: 2009, Week: 12
- Module Manufacturing Location: 1
- SDRAM Manufacturer: SK Hynix
- Error Check/Correction: None
- [Module characteristics]
- Row Address Bits: 14
- Column Address Bits: 10
- Number Of Banks: 8
- Module Density: 1024 Mb
- Number Of Ranks: 1
- Device Width: 8 bits
- Bus Width: 64 bits
- Module Nominal Voltage (VDD): 1.5 V
- [Module timing]
- Minimum SDRAM Cycle Time (tCKmin): 1.500 ns
- CAS# Latencies Supported: 6, 7, 8, 9
- Minimum CAS# Latency Time (tAAmin): 13.125 ns
- Minimum RAS# to CAS# Delay (tRCDmin): 13.125 ns
- Minimum Row Precharge Time (tRPmin): 13.125 ns
- Minimum Active to Precharge Time (tRASmin): 36.000 ns
- Supported Module Timing at 666.7 MHz: 9-9-9-24
- Supported Module Timing at 533.3 MHz: 7-7-7-20
- Supported Module Timing at 400.0 MHz: 6-6-6-15
- Minimum Write Recovery Time (tWRmin): 15.000 ns
- Minimum Row Active to Row Active Delay (tRRDmin): 6.000 ns
- Minimum Active to Active/Refresh Time (tRCmin): 49.125 ns
- Minimum Refresh Recovery Time Delay (tRFCmin): 110.000 ns
- Minimum Internal Write to Read Command Delay (tWTRmin): 7.500 ns
- Minimum Internal Read to Precharge Command Delay (tRTPmin): 7.500 ns
- Minimum Four Activate Window Delay Time (tFAWmin): 30.000 ns
- [Features]
- Partial Array Self Refresh (PASR): Not Supported
- On-die Thermal Sensor (ODTS) Readout: Not Supported
- Auto Self Refresh (ASR): Supported
- Extended Temperature 1X Refresh Rate: Not Supported
- Extended Temperature Range: Supported
- Module Temperature Sensor: Not Supported
- Pseudo Target Row Refresh (pTRR): Not Supported
- Module Nominal Height: 29 - 30 mm
- Module Maximum Thickness (Front): 1 - 2 mm
- Module Maximum Thickness (Back): 1 - 2 mm
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