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- {
- "Name": "Semiconductor Fab",
- "Description": "A highly advanced and heavily fortified semiconductor fabrication plant, with rows of precision machinery and cleanrooms.",
- "Flora": [],
- "ProductionFacilities": [
- {
- "Name": "Wafer Fabrication Line",
- "Description": "A highly advanced fabrication line for producing semiconductor wafers, utilizing precision machinery and cleanrooms to ensure high-quality output.",
- "Recipes": [
- {
- "Name": "Silicon Wafer Production",
- "Description": "Production of high-purity silicon wafers using advanced crystal growth and slicing techniques.",
- "Inputs": [
- {
- "Name": "Silicon Ingots",
- "Quantity": 10
- },
- {
- "Name": "Hydrochloric Acid",
- "Quantity": 5
- },
- {
- "Name": "Deionized Water",
- "Quantity": 20
- }
- ],
- "Outputs": [
- {
- "Name": "Silicon Wafers",
- "Quantity": 50
- }
- ]
- },
- {
- "Name": "Oxide Layer Deposition",
- "Description": "Deposition of a thin oxide layer on silicon wafers using chemical vapor deposition (CVD) techniques.",
- "Inputs": [
- {
- "Name": "Silicon Wafers",
- "Quantity": 20
- },
- {
- "Name": "Silane Gas",
- "Quantity": 10
- },
- {
- "Name": "Oxygen Gas",
- "Quantity": 10
- }
- ],
- "Outputs": [
- {
- "Name": "Oxide-Coated Wafers",
- "Quantity": 20
- }
- ]
- }
- ]
- },
- {
- "Name": "Chip Assembly Line",
- "Description": "A highly advanced production line for assembling and packaging semiconductor chips, utilizing precision machinery and cleanrooms to ensure high-quality output.",
- "Recipes": [
- {
- "Name": "Chip Assembly",
- "Description": "Assembly of semiconductor chips onto lead frames or substrates using wire bonding and encapsulation techniques.",
- "Inputs": [
- {
- "Name": "Oxide-Coated Wafers",
- "Quantity": 10
- },
- {
- "Name": "Lead Frames",
- "Quantity": 20
- },
- {
- "Name": "Wire",
- "Quantity": 50
- }
- ],
- "Outputs": [
- {
- "Name": "Assembled Chips",
- "Quantity": 50
- }
- ]
- },
- {
- "Name": "Chip Packaging",
- "Description": "Packaging of assembled chips into protective enclosures using molding and curing techniques.",
- "Inputs": [
- {
- "Name": "Assembled Chips",
- "Quantity": 50
- },
- {
- "Name": "Epoxy Resin",
- "Quantity": 10
- },
- {
- "Name": "Mold Compounds",
- "Quantity": 20
- }
- ],
- "Outputs": [
- {
- "Name": "Packaged Chips",
- "Quantity": 50
- }
- ]
- }
- ]
- },
- {
- "Name": "Test Laboratory",
- "Description": "A highly advanced laboratory facility for testing and validation of semiconductor chips, wafers, and materials, utilizing precision equipment and cleanrooms to ensure accurate results.",
- "Recipes": [
- {
- "Name": "Wafer Inspection",
- "Description": "Inspection of silicon wafers for defects and imperfections using advanced optical and electron microscopy techniques.",
- "Inputs": [
- {
- "Name": "Silicon Wafers",
- "Quantity": 20
- },
- {
- "Name": "Deionized Water",
- "Quantity": 10
- },
- {
- "Name": "Nitrogen Gas",
- "Quantity": 5
- }
- ],
- "Outputs": [
- {
- "Name": "Inspected Wafers",
- "Quantity": 20
- },
- {
- "Name": "Wafer Inspection Report",
- "Quantity": 1
- }
- ]
- },
- {
- "Name": "Chip Testing",
- "Description": "Functional testing of assembled chips for performance, reliability, and quality using automated test equipment and software.",
- "Inputs": [
- {
- "Name": "Assembled Chips",
- "Quantity": 50
- },
- {
- "Name": "Test Software",
- "Quantity": 1
- },
- {
- "Name": "Test Fixtures",
- "Quantity": 5
- }
- ],
- "Outputs": [
- {
- "Name": "Tested Chips",
- "Quantity": 50
- },
- {
- "Name": "Chip Test Report",
- "Quantity": 1
- }
- ]
- },
- {
- "Name": "Material Analysis",
- "Description": "Chemical and physical analysis of semiconductor materials using techniques such as spectroscopy and chromatography.",
- "Inputs": [
- {
- "Name": "Semiconductor Materials",
- "Quantity": 10
- },
- {
- "Name": "Solvents",
- "Quantity": 5
- },
- {
- "Name": "Reagents",
- "Quantity": 10
- }
- ],
- "Outputs": [
- {
- "Name": "Material Analysis Report",
- "Quantity": 1
- }
- ]
- }
- ]
- },
- {
- "Name": "Chemical Storage Facility",
- "Description": "A secure facility for storing and handling various chemicals and materials used in the semiconductor fabrication process, including acids, solvents, and gases.",
- "Recipes": [
- {
- "Name": "Acid Mixing",
- "Description": "Mixing of various acids for use in the semiconductor fabrication process, including hydrochloric acid and nitric acid.",
- "Inputs": [
- {
- "Name": "Hydrochloric Acid",
- "Quantity": 10
- },
- {
- "Name": "Nitric Acid",
- "Quantity": 5
- },
- {
- "Name": "Deionized Water",
- "Quantity": 20
- }
- ],
- "Outputs": [
- {
- "Name": "Mixed Acid Solution",
- "Quantity": 35
- }
- ]
- },
- {
- "Name": "Gas Cylinder Refilling",
- "Description": "Refilling of gas cylinders with various gases used in the semiconductor fabrication process, including oxygen and nitrogen.",
- "Inputs": [
- {
- "Name": "Oxygen Gas",
- "Quantity": 20
- },
- {
- "Name": "Nitrogen Gas",
- "Quantity": 10
- },
- {
- "Name": "Empty Gas Cylinders",
- "Quantity": 10
- }
- ],
- "Outputs": [
- {
- "Name": "Filled Oxygen Gas Cylinders",
- "Quantity": 10
- },
- {
- "Name": "Filled Nitrogen Gas Cylinders",
- "Quantity": 10
- }
- ]
- },
- {
- "Name": "Solvent Storage",
- "Description": "Storage and handling of various solvents used in the semiconductor fabrication process, including acetone and isopropanol.",
- "Inputs": [
- {
- "Name": "Acetone",
- "Quantity": 20
- },
- {
- "Name": "Isopropanol",
- "Quantity": 10
- }
- ],
- "Outputs": [
- {
- "Name": "Stored Solvents",
- "Quantity": 30
- }
- ]
- }
- ]
- }
- ],
- "LikelyFlora": [],
- "LikelyFauna": [],
- "LikelyBuildings": [
- "Security Checkpoint",
- "Warehouse",
- "Administrative Office",
- "Generator Building",
- "Water Treatment Plant",
- "Exhaust Ventilation System"
- ],
- "LikelyLooseItems": [
- "Face Mask",
- "Safety Goggles",
- "Factory Uniform",
- "ID Badge",
- "Toolbox",
- "Bottled Water",
- "First Aid Kit"
- ],
- "LikelyProductionFacilities": [
- "Wafer Fabrication Line",
- "Chip Assembly Line",
- "Test Laboratory",
- "Chemical Storage Facility"
- ]
- }
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