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  1. RAMMon v1.0 Build: 1007 built with SysInfo v1.0 Build: 1028
  2. PassMark (R) Software
  3. www.passmark.com
  4.  
  5. Memmory summary for V-PC:
  6. Number of Memory Devices: 2 Total Physical Memory: 8153 MB (8192 MB)
  7. Total Available Physical Memory: 5692 MB
  8. Memory Load: 30%
  9.  
  10. Item | Slot #1 | Slot #2 | Slot #3 | Slot #4 |
  11. -------------------------------------------------------------------------------|------------------------|-----------------|------------------------|-----------------|-
  12. Ram Type | DDR3 | Not Populated | DDR3 | Not Populated |
  13. Standard Name | DDR3-1600 | | DDR3-1600 | |
  14. Module Name | PC3-12800 | | PC3-12800 | |
  15. Memory Capacity (MB) | 4096 | | 4096 | |
  16. Bus Clockspeed (Mhz) | 800.00 | | 800.00 | |
  17. Jedec Manufacture Name | G Skill Intl | | G Skill Intl | |
  18. Search Amazon.com | Search! | | Search! | |
  19. SPD Revision | 1.1 | | 1.1 | |
  20. Registered | No | | No | |
  21. ECC | No | | No | |
  22. DIMM Slot # | 1 | | 3 | |
  23. Manufactured | Year 0 | | Year 0 | |
  24. Module Part # | F3-12800CL9-4GBSR2 | | F3-12800CL9-4GBSR2 | |
  25. Module Revision | 0x0 | | 0x0 | |
  26. Module Serial # | 0x0 | | 0x0 | |
  27. Module Manufacturing Location | 0 | | 0 | |
  28. # of Row Addressing Bits | 15 | | 15 | |
  29. # of Column Addressing Bits | 10 | | 10 | |
  30. # of Banks | 8 | | 8 | |
  31. # of Ranks | 2 | | 2 | |
  32. Device Width in Bits | 8 | | 8 | |
  33. Bus Width in Bits | 64 | | 64 | |
  34. Module Voltage | 1.5V, 1.35V , 1.2X V | | 1.5V, 1.35V , 1.2X V | |
  35. CAS Latencies Supported | 7 8 9 | | 7 8 9 | |
  36. Timings @ Max Frequency | 9-9-9-28 | | 9-9-9-28 | |
  37. Minimum Clock Cycle Time, tCK (ns) | 1.250 | | 1.250 | |
  38. Minimum CAS Latency Time, tAA (ns) | 11.250 | | 11.250 | |
  39. Minimum RAS to CAS Delay, tRCD (ns) | 11.250 | | 11.250 | |
  40. Minimum Row Precharge Time, tRP (ns) | 11.250 | | 11.250 | |
  41. Minimum Active to Precharge Time, tRAS (ns) | 35.000 | | 35.000 | |
  42. Minimum Row Active to Row Active Delay, tRRD (ns) | 6.000 | | 6.000 | |
  43. Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns) | 46.250 | | 46.250 | |
  44. Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns) | 160.000 | | 160.000 | |
  45. | | | | |
  46. DDR3 Specific SPD Attributes | | | | |
  47. Write Recovery Time, tWR (ns) | 15.000 | | 15.000 | |
  48. Internal Write to Read Command Delay, tWTR (ns) | 7.500 | | 7.500 | |
  49. Internal Read to Precharge Command Delay, tRTP (ns) | 7.500 | | 7.500 | |
  50. Minimum Four Activate Window Delay, tFAW (ns) | 30.000 | | 30.000 | |
  51. RZQ / 6 Supported | Yes | | Yes | |
  52. RZQ / 7 Supported | Yes | | Yes | |
  53. DLL-Off Mode Supported | Yes | | Yes | |
  54. Maximum Operating Temperature (C) | 95 | | 95 | |
  55. Refresh Rate at Extended Operating Temperature Range | 1X | | 1X | |
  56. Auto-self Refresh Supported | No | | No | |
  57. On-die Thermal Sensor Readout Supported | No | | No | |
  58. Partial Array Self Refresh Supported | Yes | | Yes | |
  59. Thermal Sensor Present | No | | No | |
  60. Non-standard SDRAM Type | Standard Monolithic | | Standard Monolithic | |
  61. Module Type | UDIMM | | UDIMM | |
  62. Module Height (mm) | 30 | | 30 | |
  63. Module Thickness (front), (mm) | 2 | | 2 | |
  64. Module Thickness (back), (mm) | 2 | | 2 | |
  65. Module Width (mm) | 133.5 | | 133.5 | |
  66. Reference Raw Card Used | Raw Card B Rev. 1 | | Raw Card B Rev. 1 | |
  67. DRAM Manufacture ID | 1229 | | 1229 | |
  68. # of DRAM Rows | 0 | | 0 | |
  69. # of Registers | 0 | | 0 | |
  70. Register Manufacturer | | | | |
  71. Register Type | | | | |
  72. Register Revision | 0 | | 0 | |
  73. | | | | |
  74. XMP Attributes | | | | |
  75. XMP Revision | 1.2 | | 1.2 | |
  76. Enthusiast / Certified Profile | | | | |
  77. Module voltage | 1.25V | | 1.25V | |
  78. Clock speed (Mhz) | 800.00 | | 800.00 | |
  79. Minimum clock cycle time, tCK (ns) | 1.250 | | 1.250 | |
  80. Supported CAS latencies | 9 | | 9 | |
  81. Minimum CAS latency time, tAA (ns) | 11.000 | | 11.000 | |
  82. Minimum RAS to CAS delay time, tRCD (ns) | 11.000 | | 11.000 | |
  83. Minimum row precharge time, tRP (ns) | 11.000 | | 11.000 | |
  84. Minimum active to precharge time, tRAS (ns) | 30.000 | | 30.000 | |
  85. Supported timing at highest clock speed | 9-9-9-24 | | 9-9-9-24 | |
  86. Minimum Row Active to Row Active Delay, tRRD (ns) | 6.000 | | 6.000 | |
  87. Minimum Active to Auto-Refresh Delay, tRC (ns) | 49.000 | | 49.000 | |
  88. Minimum Recovery Delay, tRFC (ns) | 162.500 | | 162.500 | |
  89. Minimum Write Recovery time, tWR (ns) | 15.000 | | 15.000 | |
  90. Minimum Write to Read CMD Delay, tWTR (ns) | 7.500 | | 7.500 | |
  91. Minimum Read to Pre-charge CMD Delay, tRTP (ns) | 7.500 | | 7.500 | |
  92. Minimum Four Activate Window Delay, tFAW (ns) | 62.000 | | 62.000 | |
  93. Maximum Average Periodic Refresh Interval, tREFI (us) | 7.750 | | 7.750 | |
  94. Write to Read CMD Turn-around Time Optimizations | No adjustment | | No adjustment | |
  95. Read to Write CMD Turn-around Time Optimizations | No adjustment | | No adjustment | |
  96. Back 2 Back CMD Turn-around Time Optimizations | No adjustment | | No adjustment | |
  97. System CMD Rate Mode | 2T | | 2T | |
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