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- RAMMon v1.0 Build: 1015 built with SysInfo v1.0 Build: 1097
- PassMark (R) Software
- www.passmark.com
- Memmory summary for AKASHIK:
- Number of Memory Devices: 4 Total Physical Memory: 8178 MB (77824 MB)
- Total Available Physical Memory: 6565 MB
- Memory Load: 19%
- Item | Slot #1 | Slot #2 | Slot #3 | Slot #4 |
- -------------------------------------------------------------------------------|-----------------------|-----------------------|-----------------------|-----------------------|-
- Ram Type | DDR3 | DDR3 | DDR3 | DDR3 |
- Maximum Clock Speed (MHz) | 933 (XMP) | 933 (XMP) | 933 (XMP) | 933 (XMP) |
- Maximum Transfer Speed (MHz) | DDR3-1866 | DDR3-1866 | DDR3-1866 | DDR3-1866 |
- Maximum Bandwidth (MB/s) | PC3-238900 | PC3-14900 | PC3-14900 | PC3-14900 |
- Memory Capacity (MB) | 65536 | 4096 | 4096 | 4096 |
- Jedec Manufacture Name | G Skill Intl | G Skill Intl | G Skill Intl | G Skill Intl |
- Search Amazon.com | Search! | Search! | Search! | Search! |
- SPD Revision | 1.1 | 1.1 | 1.1 | 1.1 |
- Registered | No | No | No | No |
- ECC | Yes | No | No | No |
- DIMM Slot # | 1 | 2 | 3 | 4 |
- Manufactured | | | | |
- Module Part # | F3-14900CL9-4GBSR | F3-14900CL9-4GBSR | F3-14900CL9-4GBSR | F3-14900CL9-4GBSR |
- Module Revision | 0x1 | 0x1 | 0x0 | 0x0 |
- Module Serial # | 0x0 | 0x0 | 0x0 | 0x0 |
- Module Manufacturing Location | 0 | 0 | 0 | 0 |
- # of Row Addressing Bits | 16 | 16 | 15 | 15 |
- # of Column Addressing Bits | 10 | 10 | 10 | 10 |
- # of Banks | 8 | 8 | 8 | 8 |
- # of Ranks | 1 | 1 | 2 | 2 |
- Device Width in Bits | 8 | 8 | 8 | 8 |
- Bus Width in Bits | 1024 | 64 | 64 | 64 |
- Module Voltage | 1.5V | 1.5V | 1.5V | 1.5V |
- CAS Latencies Supported | 6 7 8 9 10 11 | 6 7 8 9 10 11 | 6 7 8 9 10 11 | 6 7 8 9 10 11 |
- Timings @ Max Frequency (JEDEC) | 11-11-11-28 | 11-11-11-28 | 11-11-11-28 | 11-11-11-28 |
- Maximum frequency (MHz) | 100 | 800 | 800 | 800 |
- Maximum Transfer Speed (MHz) | DDR3-200 | DDR3-1600 | DDR3-1600 | DDR3-1600 |
- Maximum Bandwidth (MB/s) | PC3-25600 | PC3-12800 | PC3-12800 | PC3-12800 |
- Minimum Clock Cycle Time, tCK (ns) | 10.000 | 1.250 | 1.250 | 1.250 |
- Minimum CAS Latency Time, tAA (ns) | 105.000 | 13.125 | 13.125 | 13.125 |
- Minimum RAS to CAS Delay, tRCD (ns) | 105.000 | 13.125 | 13.125 | 13.125 |
- Minimum Row Precharge Time, tRP (ns) | 105.000 | 13.125 | 13.125 | 13.125 |
- Minimum Active to Precharge Time, tRAS (ns) | 280.000 | 35.000 | 35.000 | 35.000 |
- Minimum Row Active to Row Active Delay, tRRD (ns) | 48.000 | 6.000 | 6.000 | 6.000 |
- Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns) | 385.000 | 48.125 | 48.125 | 48.125 |
- Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns) | 2080.000 | 260.000 | 160.000 | 160.000 |
- | | | | |
- DDR3 Specific SPD Attributes | | | | |
- Write Recovery Time, tWR (ns) | 120.000 | 15.000 | 15.000 | 15.000 |
- Internal Write to Read Command Delay, tWTR (ns) | 60.000 | 7.500 | 7.500 | 7.500 |
- Internal Read to Precharge Command Delay, tRTP (ns) | 60.000 | 7.500 | 7.500 | 7.500 |
- Minimum Four Activate Window Delay, tFAW (ns) | 240.000 | 30.000 | 30.000 | 30.000 |
- RZQ / 6 Supported | Yes | Yes | Yes | Yes |
- RZQ / 7 Supported | Yes | Yes | Yes | Yes |
- DLL-Off Mode Supported | Yes | Yes | Yes | Yes |
- Maximum Operating Temperature Range (C) | 0-95 | 0-95 | 0-95 | 0-95 |
- Refresh Rate at Extended Operating Temperature Range | 2X | 2X | 2X | 2X |
- Auto-self Refresh Supported | No | No | Yes | Yes |
- On-die Thermal Sensor Readout Supported | No | No | No | No |
- Partial Array Self Refresh Supported | No | No | No | No |
- Thermal Sensor Present | No | No | No | No |
- Non-standard SDRAM Type | Standard Monolithic | Standard Monolithic | Standard Monolithic | Standard Monolithic |
- Module Type | UDIMM | UDIMM | UDIMM | UDIMM |
- Module Height (mm) | 30 | 30 | 30 | 30 |
- Module Thickness (front), (mm) | 2 | 2 | 2 | 2 |
- Module Thickness (back), (mm) | 1 | 1 | 2 | 2 |
- Module Width (mm) | 133.5 | 133.5 | 133.5 | 133.5 |
- Reference Raw Card Used | Raw Card A Rev. 1 | Raw Card A Rev. 1 | Raw Card B Rev. 0 | Raw Card B Rev. 0 |
- DRAM Manufacture | G Skill Intl | G Skill Intl | G Skill Intl | G Skill Intl |
- | | | | |
- XMP Attributes | | | | |
- XMP Revision | 1.3 | 1.3 | 1.3 | 1.3 |
- Enthusiast / Certified Profile | | | | |
- Module voltage | 1.50V | 1.50V | 1.50V | 1.50V |
- Clock speed (MHz) | 889 | 889 | 889 | 889 |
- Transfer Speed (MHz) | DDR3-1777 | DDR3-1777 | DDR3-1777 | DDR3-1777 |
- Bandwidth (MB/s) | PC3-227500 | PC3-14200 | PC3-14200 | PC3-14200 |
- Minimum clock cycle time, tCK (ns) | 1.125 | 1.125 | 1.125 | 1.125 |
- Supported CAS latencies | 9 | 9 | 9 | 9 |
- Minimum CAS latency time, tAA (ns) | 9.250 | 9.250 | 9.250 | 9.250 |
- Minimum RAS to CAS delay time, tRCD (ns) | 10.250 | 10.250 | 10.250 | 10.250 |
- Minimum row precharge time, tRP (ns) | 9.250 | 9.250 | 9.250 | 9.250 |
- Minimum active to precharge time, tRAS (ns) | 29.500 | 29.500 | 29.500 | 29.500 |
- Supported timing at highest clock speed | 9-10-9-27 | 9-10-9-27 | 9-10-9-27 | 9-10-9-27 |
- Minimum Row Active to Row Active Delay, tRRD (ns) | 5.000 | 5.000 | 5.000 | 5.000 |
- Minimum Active to Auto-Refresh Delay, tRC (ns) | 39.250 | 39.250 | 39.250 | 39.250 |
- Minimum Recovery Delay, tRFC (ns) | 260.000 | 260.000 | 160.000 | 160.000 |
- Minimum Write Recovery time, tWR (ns) | 14.875 | 14.875 | 14.875 | 14.875 |
- Minimum Write to Read CMD Delay, tWTR (ns) | 7.500 | 7.500 | 7.500 | 7.500 |
- Minimum Read to Pre-charge CMD Delay, tRTP (ns) | 7.500 | 7.500 | 7.500 | 7.500 |
- Minimum Four Activate Window Delay, tFAW (ns) | 27.000 | 27.000 | 25.000 | 25.000 |
- Maximum Average Periodic Refresh Interval, tREFI (us) | 7.875 | 7.875 | 7.875 | 7.875 |
- Write to Read CMD Turn-around Time Optimizations | No adjustment | No adjustment | No adjustment | No adjustment |
- Read to Write CMD Turn-around Time Optimizations | No adjustment | No adjustment | No adjustment | No adjustment |
- Back 2 Back CMD Turn-around Time Optimizations | No adjustment | No adjustment | No adjustment | No adjustment |
- System CMD Rate Mode | 2T | 2T | 2T | 2T |
- Extreme Profile | | | | |
- Module voltage | 1.50V | 1.50V | 1.50V | 1.50V |
- Clock speed (MHz) | 933 | 933 | 933 | 933 |
- Transfer Speed (MHz) | DDR3-1866 | DDR3-1866 | DDR3-1866 | DDR3-1866 |
- Bandwidth (MB/s) | PC3-238900 | PC3-14900 | PC3-14900 | PC3-14900 |
- Minimum clock cycle time, tCK (ns) | 1.071 | 1.071 | 1.071 | 1.071 |
- Supported CAS latencies | 9 | 9 | 9 | 9 |
- Minimum CAS latency time, tAA (ns) | 9.321 | 9.321 | 9.321 | 9.321 |
- Minimum RAS to CAS delay time, tRCD (ns) | 10.393 | 10.393 | 10.393 | 10.393 |
- Minimum row precharge time, tRP (ns) | 9.321 | 9.321 | 9.321 | 9.321 |
- Minimum active to precharge time, tRAS (ns) | 29.679 | 29.679 | 29.679 | 29.679 |
- Supported timing at highest clock speed | 9-10-9-28 | 9-10-9-28 | 9-10-9-28 | 9-10-9-28 |
- Minimum Row Active to Row Active Delay, tRRD (ns) | 4.929 | 4.929 | 4.929 | 4.929 |
- Minimum Active to Auto-Refresh Delay, tRC (ns) | 39.321 | 39.321 | 39.321 | 39.321 |
- Minimum Recovery Delay, tRFC (ns) | 260.250 | 260.250 | 160.179 | 160.179 |
- Minimum Write Recovery time, tWR (ns) | 15.000 | 15.000 | 15.000 | 15.000 |
- Minimum Write to Read CMD Delay, tWTR (ns) | 7.500 | 7.500 | 7.500 | 7.500 |
- Minimum Read to Pre-charge CMD Delay, tRTP (ns) | 7.500 | 7.500 | 7.500 | 7.500 |
- Minimum Four Activate Window Delay, tFAW (ns) | 27.000 | 27.000 | 24.964 | 24.964 |
- Maximum Average Periodic Refresh Interval, tREFI (us) | 7.821 | 7.821 | 7.821 | 7.821 |
- Write to Read CMD Turn-around Time Optimizations | No adjustment | No adjustment | No adjustment | No adjustment |
- Read to Write CMD Turn-around Time Optimizations | No adjustment | No adjustment | No adjustment | No adjustment |
- Back 2 Back CMD Turn-around Time Optimizations | No adjustment | No adjustment | No adjustment | No adjustment |
- System CMD Rate Mode | 1T | 1T | 1T | 1T |
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