RAM/SyS info

MemTest86 V5.0 Pro Build: 1000
PassMark (R) Software
www.passmark.com

System Information
=============================================
CPU: AMD FX-8150 Eight-Core
  CPU Clk: 3600 MHz [Turbo: 3900.5 MHz]
  L1 Cache: 80K (29903 MB/s)
  L2 Cache: 2048K (23736 MB/s)
  L3 Cache: 8192K (10916 MB/s)
Total Physical Memory: 32767M (6830 MB/s)
  DIMM #0: PC3-12800 DDR3 XMP 800MHz / 10-10-10-27 / Corsair CML32GX3M4A1600C10
  DIMM #1: PC3-12800 DDR3 XMP 800MHz / 10-10-10-27 / Corsair CML32GX3M4A1600C10
  DIMM #2: PC3-12800 DDR3 XMP 800MHz / 10-10-10-27 / Corsair CML32GX3M4A1600C10
  DIMM #3: PC3-12800 DDR3 XMP 800MHz / 10-10-10-27 / Corsair CML32GX3M4A1600C10

=============================================

Memmory summary:
Number of Memory Devices: 4
Total Physical Memory: 32767M

DIMM Slot: 1
==============
Ram Type: DDR3
  Maximum Clock Speed (MHz): 800 (XMP)
  Maximum Transfer Speed (MHz): DDR3-1600
  Maximum Bandwidth (MB/s): PC3-12800
Memory Capacity (MB): 8192
Jedec Manufacture Name: Corsair
SPD Revision: 1.1
Registered: No
ECC: No
DIMM Slot #: 1
Manufactured: Week 13 of Year 2012
Module Part #: CML32GX3M4A1600C10
Module Revision: 0x0000
Module Serial #: 0x00000000
Module Manufacturing Location: 0x01
# of Row Addressing Bits: 16
# of Column Addressing Bits: 10
# of Banks: 8
# of Ranks: 2
Device Width in Bits: 8
Bus Width in Bits: 64
Module Voltage: 1.5V
CAS Latencies Supported: 6 7 9
Timings @ Max Frequency (JEDEC): 9-9-9-24
  Maximum frequency (MHz): 666
  Maximum Transfer Speed (MHz): DDR3-1333
  Maximum Bandwidth (MB/s): PC3-10600
  Minimum Clock Cycle Time, tCK (ns): 1.500
  Minimum CAS Latency Time, tAA (ns): 13.125
  Minimum RAS to CAS Delay, tRCD (ns): 13.125
  Minimum Row Precharge Time, tRP (ns): 13.125
  Minimum Active to Precharge Time, tRAS (ns): 36.000
  Minimum Row Active to Row Active Delay, tRRD (ns): 6.000
  Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns): 48.125
  Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns): 260.000
DDR3 Specific SPD Attributes
  Write Recover Time, tWR (ns): 15.000
  Internal Write to Read Command Delay, tWTR (ns): 7.500
  Internal Read to Precharge Command Delay, tRTP (ns): 7.500
  Minimum Four Activate Window Delay (ns): 30.000
  RZQ / 6 Supported: Yes
  RZQ / 7 Supported: Yes
  DLL-Off Mode Supported: Yes
  Maximum Operating Temperature Range (C): 0-95C
  Refresh Rate at Extended Operating Temperature Range: 2X
  Auto-Self Refresh Supported: No
  On-die Thermal Sensor Readout Supported: No
  Partial Array Self Refresh Supported: Yes
  Thermal Sensor Present: No
  Non-standard SDRAM Type: Standard Monolithic
  Module Type: UDIMM
  Module Height (mm): 29 - 30
  Module Thickness (mm): front 2-3 , back 2-3
  Module Width (mm): 133.5
  Reference Raw Card Used: Raw Card B Rev. 0
  DRAM Manufacture ID: 0x0000
  # of Registers: 0
  Register Revision: 0x00
XMP Enthusiast / Certified Profile (Revision: 1.3)
  Module voltage: 1.500V
  Clock speed (MHz): 800
  Transfer Speed (MHz): DDR3-1600
  Bandwidth (MB/s): PC3-12800
  Minimum clock cycle time, tCK (ns): 1.250
  Supported CAS latencies: 6 10
  Minimum CAS latency time, tAA (ns): 12.500
  Minimum RAS to CAS delay time, tRCD (ns): 12.500
  Minimum row precharge time, tRP (ns): 12.500
  Minimum active to precharge time, tRAS (ns): 33.750
  Supported timing at highest clock speed: 10-10-10-27
  Minimum Row Active to Row Active Delay, tRRD (ns): 7.500
  Minimum Active to Auto-Refresh Delay, tRC (ns): 50.625
  Minimum Recovery Delay, tRFC (ns): 260.000
  Minimum Write Recovery time, tWR (ns): 15.000
  Minimum Write to Read CMD Delay, tWTR (ns): 7.500
  Minimum Read to Pre-charge CMD Delay, tRTP (ns): 7.500
  Minimum Four Activate Window Delay, tFAW (ns): 37.500
  Maximum Average Periodic Refresh Interval, tREFI (us): 7.750
  Write to Read CMD Turn-around Time Optimizations: No adjustment
  Read to Write CMD Turn-around Time Optimizations: No adjustment
  Back 2 Back CMD Turn-around Time Optimizations: No adjustment
  System CMD Rate Mode: 2T

DIMM Slot: 2
==============
Ram Type: DDR3
  Maximum Clock Speed (MHz): 800 (XMP)
  Maximum Transfer Speed (MHz): DDR3-1600
  Maximum Bandwidth (MB/s): PC3-12800
Memory Capacity (MB): 8192
Jedec Manufacture Name: Corsair
SPD Revision: 1.1
Registered: No
ECC: No
DIMM Slot #: 2
Manufactured: Week 13 of Year 2012
Module Part #: CML32GX3M4A1600C10
Module Revision: 0x0000
Module Serial #: 0x00000000
Module Manufacturing Location: 0x01
# of Row Addressing Bits: 16
# of Column Addressing Bits: 10
# of Banks: 8
# of Ranks: 2
Device Width in Bits: 8
Bus Width in Bits: 64
Module Voltage: 1.5V
CAS Latencies Supported: 6 7 9
Timings @ Max Frequency (JEDEC): 9-9-9-24
  Maximum frequency (MHz): 666
  Maximum Transfer Speed (MHz): DDR3-1333
  Maximum Bandwidth (MB/s): PC3-10600
  Minimum Clock Cycle Time, tCK (ns): 1.500
  Minimum CAS Latency Time, tAA (ns): 13.125
  Minimum RAS to CAS Delay, tRCD (ns): 13.125
  Minimum Row Precharge Time, tRP (ns): 13.125
  Minimum Active to Precharge Time, tRAS (ns): 36.000
  Minimum Row Active to Row Active Delay, tRRD (ns): 6.000
  Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns): 48.125
  Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns): 260.000
DDR3 Specific SPD Attributes
  Write Recover Time, tWR (ns): 15.000
  Internal Write to Read Command Delay, tWTR (ns): 7.500
  Internal Read to Precharge Command Delay, tRTP (ns): 7.500
  Minimum Four Activate Window Delay (ns): 30.000
  RZQ / 6 Supported: Yes
  RZQ / 7 Supported: Yes
  DLL-Off Mode Supported: Yes
  Maximum Operating Temperature Range (C): 0-95C
  Refresh Rate at Extended Operating Temperature Range: 2X
  Auto-Self Refresh Supported: No
  On-die Thermal Sensor Readout Supported: No
  Partial Array Self Refresh Supported: Yes
  Thermal Sensor Present: No
  Non-standard SDRAM Type: Standard Monolithic
  Module Type: UDIMM
  Module Height (mm): 29 - 30
  Module Thickness (mm): front 2-3 , back 2-3
  Module Width (mm): 133.5
  Reference Raw Card Used: Raw Card B Rev. 0
  DRAM Manufacture ID: 0x0000
  # of Registers: 0
  Register Revision: 0x00
XMP Enthusiast / Certified Profile (Revision: 1.3)
  Module voltage: 1.500V
  Clock speed (MHz): 800
  Transfer Speed (MHz): DDR3-1600
  Bandwidth (MB/s): PC3-12800
  Minimum clock cycle time, tCK (ns): 1.250
  Supported CAS latencies: 6 10
  Minimum CAS latency time, tAA (ns): 12.500
  Minimum RAS to CAS delay time, tRCD (ns): 12.500
  Minimum row precharge time, tRP (ns): 12.500
  Minimum active to precharge time, tRAS (ns): 33.750
  Supported timing at highest clock speed: 10-10-10-27
  Minimum Row Active to Row Active Delay, tRRD (ns): 7.500
  Minimum Active to Auto-Refresh Delay, tRC (ns): 50.625
  Minimum Recovery Delay, tRFC (ns): 260.000
  Minimum Write Recovery time, tWR (ns): 15.000
  Minimum Write to Read CMD Delay, tWTR (ns): 7.500
  Minimum Read to Pre-charge CMD Delay, tRTP (ns): 7.500
  Minimum Four Activate Window Delay, tFAW (ns): 37.500
  Maximum Average Periodic Refresh Interval, tREFI (us): 7.750
  Write to Read CMD Turn-around Time Optimizations: No adjustment
  Read to Write CMD Turn-around Time Optimizations: No adjustment
  Back 2 Back CMD Turn-around Time Optimizations: No adjustment
  System CMD Rate Mode: 2T

DIMM Slot: 3
==============
Ram Type: DDR3
  Maximum Clock Speed (MHz): 800 (XMP)
  Maximum Transfer Speed (MHz): DDR3-1600
  Maximum Bandwidth (MB/s): PC3-12800
Memory Capacity (MB): 8192
Jedec Manufacture Name: Corsair
SPD Revision: 1.1
Registered: No
ECC: No
DIMM Slot #: 3
Manufactured: Week 13 of Year 2012
Module Part #: CML32GX3M4A1600C10
Module Revision: 0x0000
Module Serial #: 0x00000000
Module Manufacturing Location: 0x01
# of Row Addressing Bits: 16
# of Column Addressing Bits: 10
# of Banks: 8
# of Ranks: 2
Device Width in Bits: 8
Bus Width in Bits: 64
Module Voltage: 1.5V
CAS Latencies Supported: 6 7 9
Timings @ Max Frequency (JEDEC): 9-9-9-24
  Maximum frequency (MHz): 666
  Maximum Transfer Speed (MHz): DDR3-1333
  Maximum Bandwidth (MB/s): PC3-10600
  Minimum Clock Cycle Time, tCK (ns): 1.500
  Minimum CAS Latency Time, tAA (ns): 13.125
  Minimum RAS to CAS Delay, tRCD (ns): 13.125
  Minimum Row Precharge Time, tRP (ns): 13.125
  Minimum Active to Precharge Time, tRAS (ns): 36.000
  Minimum Row Active to Row Active Delay, tRRD (ns): 6.000
  Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns): 48.125
  Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns): 260.000
DDR3 Specific SPD Attributes
  Write Recover Time, tWR (ns): 15.000
  Internal Write to Read Command Delay, tWTR (ns): 7.500
  Internal Read to Precharge Command Delay, tRTP (ns): 7.500
  Minimum Four Activate Window Delay (ns): 30.000
  RZQ / 6 Supported: Yes
  RZQ / 7 Supported: Yes
  DLL-Off Mode Supported: Yes
  Maximum Operating Temperature Range (C): 0-95C
  Refresh Rate at Extended Operating Temperature Range: 2X
  Auto-Self Refresh Supported: No
  On-die Thermal Sensor Readout Supported: No
  Partial Array Self Refresh Supported: Yes
  Thermal Sensor Present: No
  Non-standard SDRAM Type: Standard Monolithic
  Module Type: UDIMM
  Module Height (mm): 29 - 30
  Module Thickness (mm): front 2-3 , back 2-3
  Module Width (mm): 133.5
  Reference Raw Card Used: Raw Card B Rev. 0
  DRAM Manufacture ID: 0x0000
  # of Registers: 0
  Register Revision: 0x00
XMP Enthusiast / Certified Profile (Revision: 1.3)
  Module voltage: 1.500V
  Clock speed (MHz): 800
  Transfer Speed (MHz): DDR3-1600
  Bandwidth (MB/s): PC3-12800
  Minimum clock cycle time, tCK (ns): 1.250
  Supported CAS latencies: 6 10
  Minimum CAS latency time, tAA (ns): 12.500
  Minimum RAS to CAS delay time, tRCD (ns): 12.500
  Minimum row precharge time, tRP (ns): 12.500
  Minimum active to precharge time, tRAS (ns): 33.750
  Supported timing at highest clock speed: 10-10-10-27
  Minimum Row Active to Row Active Delay, tRRD (ns): 7.500
  Minimum Active to Auto-Refresh Delay, tRC (ns): 50.625
  Minimum Recovery Delay, tRFC (ns): 260.000
  Minimum Write Recovery time, tWR (ns): 15.000
  Minimum Write to Read CMD Delay, tWTR (ns): 7.500
  Minimum Read to Pre-charge CMD Delay, tRTP (ns): 7.500
  Minimum Four Activate Window Delay, tFAW (ns): 37.500
  Maximum Average Periodic Refresh Interval, tREFI (us): 7.750
  Write to Read CMD Turn-around Time Optimizations: No adjustment
  Read to Write CMD Turn-around Time Optimizations: No adjustment
  Back 2 Back CMD Turn-around Time Optimizations: No adjustment
  System CMD Rate Mode: 2T

DIMM Slot: 4
==============
Ram Type: DDR3
  Maximum Clock Speed (MHz): 800 (XMP)
  Maximum Transfer Speed (MHz): DDR3-1600
  Maximum Bandwidth (MB/s): PC3-12800
Memory Capacity (MB): 8192
Jedec Manufacture Name: Corsair
SPD Revision: 1.1
Registered: No
ECC: No
DIMM Slot #: 4
Manufactured: Week 13 of Year 2012
Module Part #: CML32GX3M4A1600C10
Module Revision: 0x0000
Module Serial #: 0x00000000
Module Manufacturing Location: 0x01
# of Row Addressing Bits: 16
# of Column Addressing Bits: 10
# of Banks: 8
# of Ranks: 2
Device Width in Bits: 8
Bus Width in Bits: 64
Module Voltage: 1.5V
CAS Latencies Supported: 6 7 9
Timings @ Max Frequency (JEDEC): 9-9-9-24
  Maximum frequency (MHz): 666
  Maximum Transfer Speed (MHz): DDR3-1333
  Maximum Bandwidth (MB/s): PC3-10600
  Minimum Clock Cycle Time, tCK (ns): 1.500
  Minimum CAS Latency Time, tAA (ns): 13.125
  Minimum RAS to CAS Delay, tRCD (ns): 13.125
  Minimum Row Precharge Time, tRP (ns): 13.125
  Minimum Active to Precharge Time, tRAS (ns): 36.000
  Minimum Row Active to Row Active Delay, tRRD (ns): 6.000
  Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns): 48.125
  Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns): 260.000
DDR3 Specific SPD Attributes
  Write Recover Time, tWR (ns): 15.000
  Internal Write to Read Command Delay, tWTR (ns): 7.500
  Internal Read to Precharge Command Delay, tRTP (ns): 7.500
  Minimum Four Activate Window Delay (ns): 30.000
  RZQ / 6 Supported: Yes
  RZQ / 7 Supported: Yes
  DLL-Off Mode Supported: Yes
  Maximum Operating Temperature Range (C): 0-95C
  Refresh Rate at Extended Operating Temperature Range: 2X
  Auto-Self Refresh Supported: No
  On-die Thermal Sensor Readout Supported: No
  Partial Array Self Refresh Supported: Yes
  Thermal Sensor Present: No
  Non-standard SDRAM Type: Standard Monolithic
  Module Type: UDIMM
  Module Height (mm): 29 - 30
  Module Thickness (mm): front 2-3 , back 2-3
  Module Width (mm): 133.5
  Reference Raw Card Used: Raw Card B Rev. 0
  DRAM Manufacture ID: 0x0000
  # of Registers: 0
  Register Revision: 0x00
XMP Enthusiast / Certified Profile (Revision: 1.3)
  Module voltage: 1.500V
  Clock speed (MHz): 800
  Transfer Speed (MHz): DDR3-1600
  Bandwidth (MB/s): PC3-12800
  Minimum clock cycle time, tCK (ns): 1.250
  Supported CAS latencies: 6 10
  Minimum CAS latency time, tAA (ns): 12.500
  Minimum RAS to CAS delay time, tRCD (ns): 12.500
  Minimum row precharge time, tRP (ns): 12.500
  Minimum active to precharge time, tRAS (ns): 33.750
  Supported timing at highest clock speed: 10-10-10-27
  Minimum Row Active to Row Active Delay, tRRD (ns): 7.500
  Minimum Active to Auto-Refresh Delay, tRC (ns): 50.625
  Minimum Recovery Delay, tRFC (ns): 260.000
  Minimum Write Recovery time, tWR (ns): 15.000
  Minimum Write to Read CMD Delay, tWTR (ns): 7.500
  Minimum Read to Pre-charge CMD Delay, tRTP (ns): 7.500
  Minimum Four Activate Window Delay, tFAW (ns): 37.500
  Maximum Average Periodic Refresh Interval, tREFI (us): 7.750
  Write to Read CMD Turn-around Time Optimizations: No adjustment
  Read to Write CMD Turn-around Time Optimizations: No adjustment
  Back 2 Back CMD Turn-around Time Optimizations: No adjustment
  System CMD Rate Mode: 2T