TSSOP-14-1EP_4.4x5mm_Pitch0.65mm

(module TSSOP-14-1EP_4.4x5mm_Pitch0.65mm (layer F.Cu) (tedit 54130A77)
  (descr "TSSOP - 14 EP; CASE 948AW (see ON Semiconductor 948AW.PDF)")
  (tags "SSOP 0.65")
  (attr smd)
  (fp_text reference TSSOP-14-1EP_4.4x5mm_Pitch0.65mm (at 0 -3.55) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value VAL** (at 0 3.55) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start -3.6 -2.8) (end -3.6 2.8) (layer F.CrtYd) (width 0.05))
  (fp_line (start 3.6 -2.8) (end 3.6 2.8) (layer F.CrtYd) (width 0.05))
  (fp_line (start -3.6 -2.8) (end 3.6 -2.8) (layer F.CrtYd) (width 0.05))
  (fp_line (start -3.6 2.8) (end 3.6 2.8) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.325 -2.625) (end -2.325 -2.385) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.325 -2.625) (end 2.325 -2.385) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.325 2.625) (end 2.325 2.385) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.325 2.625) (end -2.325 2.385) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.325 -2.625) (end 2.325 -2.625) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.325 2.625) (end 2.325 2.625) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.325 -2.385) (end -3.35 -2.385) (layer F.SilkS) (width 0.15))
  (pad 1 smd rect (at -2.775 -1.95) (size 1.15 0.42) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -2.775 -1.3) (size 1.15 0.42) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -2.775 -0.65) (size 1.15 0.42) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -2.775 0) (size 1.15 0.42) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at -2.775 0.65) (size 1.15 0.42) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at -2.775 1.3) (size 1.15 0.42) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at -2.775 1.95) (size 1.15 0.42) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at 2.775 1.95) (size 1.15 0.42) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at 2.775 1.3) (size 1.15 0.42) (layers F.Cu F.Paste F.Mask))
  (pad 10 smd rect (at 2.775 0.65) (size 1.15 0.42) (layers F.Cu F.Paste F.Mask))
  (pad 11 smd rect (at 2.775 0) (size 1.15 0.42) (layers F.Cu F.Paste F.Mask))
  (pad 12 smd rect (at 2.775 -0.65) (size 1.15 0.42) (layers F.Cu F.Paste F.Mask))
  (pad 13 smd rect (at 2.775 -1.3) (size 1.15 0.42) (layers F.Cu F.Paste F.Mask))
  (pad 14 smd rect (at 2.775 -1.95) (size 1.15 0.42) (layers F.Cu F.Paste F.Mask))
  (pad 15 smd rect (at 0.765 1.275) (size 1.53 0.85) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 15 smd rect (at 0.765 0.425) (size 1.53 0.85) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 15 smd rect (at 0.765 -0.425) (size 1.53 0.85) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 15 smd rect (at 0.765 -1.275) (size 1.53 0.85) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 15 smd rect (at -0.765 1.275) (size 1.53 0.85) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 15 smd rect (at -0.765 0.425) (size 1.53 0.85) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 15 smd rect (at -0.765 -0.425) (size 1.53 0.85) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 15 smd rect (at -0.765 -1.275) (size 1.53 0.85) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (model Housings_SSOP/TSSOP-14-1EP_4.4x5mm_Pitch0.65mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)