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- Sensor Value Min Max
- DAMPEREN-PC
- Winbond W83627DHG
- Voltages
- CPU VCORE 1.02 V 1.02 V 1.10 V
- VIN1 1.76 V 1.75 V 1.77 V
- +3.3V 3.31 V 3.30 V 3.31 V
- +5V 4.92 V 4.90 V 4.92 V
- +12V 11.65 V 11.65 V 11.71 V
- VIN6 0.97 V 0.97 V 0.98 V
- Temperatures
- SYSTIN 34 °C (93 °F) 33 °C (91 °F) 34 °C (93 °F)
- CPUTIN 34 °C (92 °F) 32 °C (89 °F) 35 °C (94 °F)
- AUXTIN 36 °C (96 °F) 36 °C (95 °F) 36 °C (96 °F)
- Analog Device ASP0800
- Currents
- CPU 5.04 A 5.04 A 8.44 A
- Powers
- CPU 5.26 W 5.25 W 8.77 W
- Intel Core i7 920
- Temperatures
- Core #0 45 °C (112 °F) 42 °C (107 °F) 45 °C (112 °F)
- Core #1 43 °C (109 °F) 40 °C (103 °F) 43 °C (109 °F)
- Core #2 45 °C (112 °F) 43 °C (109 °F) 45 °C (112 °F)
- Core #3 42 °C (107 °F) 40 °C (103 °F) 43 °C (109 °F)
- Powers
- Processor 41.69 W 35.48 W 56.00 W
- SAMSUNG HD103UJ
- Temperatures
- Assembly 20 °C (67 °F) 19 °C (66 °F) 20 °C (67 °F)
- Air Flow 15 °C (58 °F) 15 °C (58 °F) 15 °C (58 °F)
- DAMPEREN-PC
- Winbond W83627DHG
- Voltages
- CPU VCORE 1.02 V 1.02 V 1.10 V
- VIN1 1.76 V 1.75 V 1.77 V
- +3.3V 3.31 V 3.30 V 3.31 V
- +5V 4.92 V 4.90 V 4.92 V
- +12V 11.65 V 11.65 V 11.71 V
- VIN6 0.98 V 0.97 V 0.98 V
- Temperatures
- SYSTIN 34 °C (93 °F) 33 °C (91 °F) 34 °C (93 °F)
- CPUTIN 33 °C (91 °F) 32 °C (89 °F) 34 °C (92 °F)
- AUXTIN 36 °C (96 °F) 36 °C (95 °F) 36 °C (96 °F)
- Analog Device ASP0800
- Currents
- CPU 5.27 A 5.04 A 6.63 A
- Powers
- CPU 5.48 W 5.25 W 7.39 W
- Intel Core i7 920
- Temperatures
- Core #0 44 °C (111 °F) 42 °C (107 °F) 45 °C (112 °F)
- Core #1 42 °C (107 °F) 40 °C (103 °F) 42 °C (107 °F)
- Core #2 45 °C (112 °F) 43 °C (109 °F) 45 °C (112 °F)
- Core #3 42 °C (107 °F) 40 °C (103 °F) 42 °C (107 °F)
- Powers
- Processor 41.69 W 35.48 W 56.00 W
- SAMSUNG HD103UJ
- Temperatures
- Assembly 20 °C (67 °F) 19 °C (66 °F) 20 °C (67 °F)
- Air Flow 15 °C (58 °F) 15 °C (58 °F) 15 °C (58 °F)
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