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- * DDR-SDRAM PC-3200 (DDR-400) Samsung, M3 68L6423HUN-CCC, 512 MB
- Fabbricante : Samsung
- Part Number : M3 68L6423HUN-CCC
- Numero Seriale : xxxxxxxxx
- Type : DDR-SDRAM PC-3200 (200 MHz) - [DDR-400]
- Dimensione : 512 MB (2 rows, 4 banks)
- Module Buffered : No
- Module Registered : No
- Module SLi Ready (EPP) : No
- Larghezza : 64-bit
- Capacità di Correzione Errore (ECC) : No
- Max. Burst Length : 8
- Refresh : Reduced (.5x)7.8 ?s, Self Refresh?s
- Voltage : SSTL 2.5vv
- Prefetch Buffer : 2-bit
- Costruttore : Settimana 19 di 2007
- Frequenze supportate : 166 MHz, 200 MHz
- CAS Latency (tCL) : 2.5 clocks @ 166 MHz, 3 clocks @ 200 MHz
- RAS to CAS (tRCD) : 3 clocks @ 166 MHz, 3 clocks @ 200 MHz
- RAS Precharge (tRP) : 3 clocks @ 166 MHz, 3 clocks @ 200 MHz
- Cycle Time (tRAS) : 7 clocks @ 166 MHz, 8 clocks @ 200 MHz
- * DDR-SDRAM PC-3200 (DDR-400) Infineon, 256 MB
- Fabbricante : Non specificato
- Part Number : Non specificato
- Numero Seriale : Non specificato
- Type : DDR-SDRAM PC-3200 (200 MHz) - [DDR-400]
- Dimensione : 256 MB (1 rows, 4 banks)
- Module Buffered : No
- Module Registered : No
- Module SLi Ready (EPP) : No
- Larghezza : 64-bit
- Capacità di Correzione Errore (ECC) : No
- Max. Burst Length : 8
- Refresh : Reduced (.5x)7.8 ?s, Self Refresh?s
- Voltage : SSTL 2.5vv
- Prefetch Buffer : 2-bit
- Costruttore : 2000
- Frequenze supportate : 133 MHz, 166 MHz, 200 MHz
- CAS Latency (tCL) : 2 clocks @ 133 MHz, 2.5 clocks @ 166 MHz, 3 clocks @ 200 MHz
- RAS to CAS (tRCD) : 2 clocks @ 133 MHz, 3 clocks @ 166 MHz, 3 clocks @ 200 MHz
- RAS Precharge (tRP) : 2 clocks @ 133 MHz, 3 clocks @ 166 MHz, 3 clocks @ 200 MHz
- Cycle Time (tRAS) : 6 clocks @ 133 MHz, 7 clocks @ 166 MHz, 8 clocks @ 200 MHz
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