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  1. * DDR-SDRAM PC-3200 (DDR-400) Samsung, M3 68L6423HUN-CCC, 512 MB
  2.  
  3. Fabbricante : Samsung
  4. Part Number : M3 68L6423HUN-CCC
  5. Numero Seriale : xxxxxxxxx
  6. Type : DDR-SDRAM PC-3200 (200 MHz) - [DDR-400]
  7. Dimensione : 512 MB (2 rows, 4 banks)
  8. Module Buffered : No
  9. Module Registered : No
  10. Module SLi Ready (EPP) : No
  11. Larghezza : 64-bit
  12. Capacità di Correzione Errore (ECC) : No
  13. Max. Burst Length : 8
  14. Refresh : Reduced (.5x)7.8 ?s, Self Refresh?s
  15. Voltage : SSTL 2.5vv
  16. Prefetch Buffer : 2-bit
  17. Costruttore : Settimana 19 di 2007
  18. Frequenze supportate : 166 MHz, 200 MHz
  19. CAS Latency (tCL) : 2.5 clocks @ 166 MHz, 3 clocks @ 200 MHz
  20. RAS to CAS (tRCD) : 3 clocks @ 166 MHz, 3 clocks @ 200 MHz
  21. RAS Precharge (tRP) : 3 clocks @ 166 MHz, 3 clocks @ 200 MHz
  22. Cycle Time (tRAS) : 7 clocks @ 166 MHz, 8 clocks @ 200 MHz
  23.  
  24.  
  25. * DDR-SDRAM PC-3200 (DDR-400) Infineon, 256 MB
  26.  
  27. Fabbricante : Non specificato
  28. Part Number : Non specificato
  29. Numero Seriale : Non specificato
  30. Type : DDR-SDRAM PC-3200 (200 MHz) - [DDR-400]
  31. Dimensione : 256 MB (1 rows, 4 banks)
  32. Module Buffered : No
  33. Module Registered : No
  34. Module SLi Ready (EPP) : No
  35. Larghezza : 64-bit
  36. Capacità di Correzione Errore (ECC) : No
  37. Max. Burst Length : 8
  38. Refresh : Reduced (.5x)7.8 ?s, Self Refresh?s
  39. Voltage : SSTL 2.5vv
  40. Prefetch Buffer : 2-bit
  41. Costruttore : 2000
  42. Frequenze supportate : 133 MHz, 166 MHz, 200 MHz
  43. CAS Latency (tCL) : 2 clocks @ 133 MHz, 2.5 clocks @ 166 MHz, 3 clocks @ 200 MHz
  44. RAS to CAS (tRCD) : 2 clocks @ 133 MHz, 3 clocks @ 166 MHz, 3 clocks @ 200 MHz
  45. RAS Precharge (tRP) : 2 clocks @ 133 MHz, 3 clocks @ 166 MHz, 3 clocks @ 200 MHz
  46. Cycle Time (tRAS) : 6 clocks @ 133 MHz, 7 clocks @ 166 MHz, 8 clocks @ 200 MHz
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