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  1. HWiNFO64 Version 4.20-1960
  2.  
  3. Central Processor(s) ------------------------------------------------------
  4.  
  5. [CPU Unit Count]
  6. Number Of Processor Packages (Physical): 1
  7. Number Of Processors Cores: 4
  8. Number Of Logical Processors: 4
  9.  
  10. AMD Athlon II X4 645 ------------------------------------------------------
  11.  
  12. [General Information]
  13. Processor Name: AMD Athlon II X4 645
  14. Original Processor Frequency: 3100.0 MHz
  15. Original Processor Frequency [MHz]: 3100
  16. CPU ID: 00100F53
  17. Extended CPU ID: 00100F53
  18. CPU Thermal Design Power (TDP): 94.5 W
  19. CPU Thermal Design Current (TDC): 75.6 A
  20. Number of CPU Cores: 4
  21. Number of Logical CPUs: 4
  22. [Operating Points]
  23. CPU HFM (Maximum): 3100.0 MHz = 15.50 x 200.0 MHz @ 1.3750 V
  24. CPU Current: 3113.3 MHz = 15.50 x 200.9 MHz @ 1.3750 V
  25. Northbridge Maximum: 2000.0 MHz = 10.00 x 200.0 MHz @ 1.3750 V
  26. Northbridge Current: 2000.0 MHz = 10.00 x 200.0 MHz @ 1.1750 V
  27. CPU Bus Type: Hyper-Transport v3.00
  28. Maximum Supported Hyper-Transport Link Clock: 2000 MHz
  29. Current Hyper-Transport Link Clock: 2000 MHz
  30. [Cache and TLB]
  31. L1 Cache: Instruction: 4 x 64 KBytes, Data: 4 x 64 KBytes
  32. L2 Cache: Integrated: 4 x 512 KBytes
  33. [Standard Feature Flags]
  34. [Extended Feature Flags]
  35. [Enhanced Features]
  36. [Memory Ranges]
  37. [MTRRs]
  38.  
  39. Motherboard ---------------------------------------------------------------
  40.  
  41. [Computer]
  42. [Motherboard]
  43. Motherboard Model: GIGABYTE GA-880GM-UD2H
  44. Motherboard Chipset: AMD RS880 + SB750/SB710
  45. Motherboard Slots: 2xPCI, 1xAGP, 1xPCI Express x1, 1xPCI Express x16
  46. PCI Express Version Supported: v2.0
  47. USB Version Supported: v2.0
  48. [BIOS]
  49. Super-IO/LPC Chip: ITE IT8720F
  50.  
  51. Memory --------------------------------------------------------------------
  52.  
  53. [General information]
  54. Total Memory Size: 4 GBytes
  55. Total Memory Size [MB]: 4096
  56. [Current Performance Settings]
  57. Maximum Supported Memory Clock: 666.7 MHz
  58. Current Memory Clock: 669.5 MHz
  59. Current Timing (tCAS-tRCD-tRP-tRAS): 9.0-9-9-24
  60. Memory Runs At: Single-Channel
  61. Command Rate: 2T
  62. Read to Read Delay (tRD_RD) Different Rank: 4T
  63. Write to Write Delay (tWR_WR) Different Rank: 4T
  64. Write to Read Delay (tWR_RD) Same Rank (tWTR): 5T
  65. Write to Precharge Delay (tWTP): 21T
  66. Write Recovery Time (tWR): 10T
  67. RAS# to RAS# Delay (tRRD): 5T
  68. Row Cycle Time (tRC): 34T
  69. Four Activate Window (tFAW): 24T
  70.  
  71. Row: 0 - 2048 MB PC3-10600 DDR3 SDRAM Corsair VS2GB1333D4 -----------------
  72.  
  73. [General Module Information]
  74. Module Number: 0
  75. Module Size: 2048 MBytes
  76. Memory Type: DDR3 SDRAM
  77. Module Type: Unbuffered DIMM (UDIMM)
  78. Memory Speed: 666.7 MHz (PC3-10600)
  79. Module Manufacturer: Corsair
  80. Module Part Number: VS2GB1333D4
  81. Module Revision: 0
  82. Module Serial Number: 0
  83. Module Manufacturing Date: Year: 2000, Week: 0
  84. Module Manufacturing Location: 1
  85. SDRAM Manufacturer: Unknown
  86. Error Check/Correction: None
  87. [Module characteristics]
  88. Row Address Bits: 15
  89. Column Address Bits: 10
  90. Number Of Banks: 8
  91. Module Density: 2048 Mb
  92. Number Of Ranks: 1
  93. Device Width: 8 bits
  94. Bus Width: 64 bits
  95. Module Nominal Voltage (VDD): 1.5 V
  96. [Module timing]
  97. Minimum SDRAM Cycle Time (tCKmin): 1.500 ns
  98. CAS# Latencies Supported: 6, 7, 8, 9
  99. Minimum CAS# Latency Time (tAAmin): 13.500 ns
  100. Minimum RAS# to CAS# Delay (tRCDmin): 13.500 ns
  101. Minimum Row Precharge Time (tRPmin): 13.500 ns
  102. Minimum Active to Precharge Time (tRASmin): 36.000 ns
  103. Supported Module Timing at 666.7 MHz: 9-9-9-24
  104. Supported Module Timing at 533.3 MHz: 8-8-8-20
  105. Supported Module Timing at 400.0 MHz: 6-6-6-15
  106. Minimum Write Recovery Time (tWRmin): 15.000 ns
  107. Minimum Row Active to Row Active Delay (tRRDmin): 7.500 ns
  108. Minimum Active to Active/Refresh Time (tRCmin): 50.625 ns
  109. Minimum Refresh Recovery Time Delay (tRFCmin): 160.000 ns
  110. Minimum Internal Write to Read Command Delay (tWTRmin): 7.500 ns
  111. Minimum Internal Read to Precharge Command Delay (tRTPmin): 7.500 ns
  112. Minimum Four Activate Window Delay Time (tFAWmin): 37.500 ns
  113. [Features]
  114. On-die Thermal Sensor (ODTS) Readout: Not Supported
  115. Auto Self Refresh (ASR): Not Supported
  116. Extended Temperature Refresh Rate: Not Supported
  117. Extended Temperature Range: Supported
  118. Module Temperature Sensor: Not Supported
  119. Module Nominal Height: 30 - 31 mm
  120. Module Maximum Thickness (Front): 2 - 3 mm
  121. Module Maximum Thickness (Back): 2 - 3 mm
  122.  
  123. Row: 2 - 2048 MB PC3-10600 DDR3 SDRAM Corsair VS2GB1333D3 -----------------
  124.  
  125. [General Module Information]
  126. Module Number: 2
  127. Module Size: 2048 MBytes
  128. Memory Type: DDR3 SDRAM
  129. Module Type: Unbuffered DIMM (UDIMM)
  130. Memory Speed: 666.7 MHz (PC3-10600)
  131. Module Manufacturer: Corsair
  132. Module Part Number: VS2GB1333D3
  133. Module Revision: 0
  134. Module Serial Number: 0
  135. Module Manufacturing Date: Year: 2000, Week: 0
  136. Module Manufacturing Location: 1
  137. SDRAM Manufacturer: Unknown
  138. Error Check/Correction: None
  139. [Module characteristics]
  140. Row Address Bits: 14
  141. Column Address Bits: 10
  142. Number Of Banks: 8
  143. Module Density: 1024 Mb
  144. Number Of Ranks: 2
  145. Device Width: 8 bits
  146. Bus Width: 64 bits
  147. Module Nominal Voltage (VDD): 1.5 V
  148. [Module timing]
  149. Minimum SDRAM Cycle Time (tCKmin): 1.500 ns
  150. CAS# Latencies Supported: 6, 7, 8, 9
  151. Minimum CAS# Latency Time (tAAmin): 13.500 ns
  152. Minimum RAS# to CAS# Delay (tRCDmin): 13.500 ns
  153. Minimum Row Precharge Time (tRPmin): 13.500 ns
  154. Minimum Active to Precharge Time (tRASmin): 36.000 ns
  155. Supported Module Timing at 666.7 MHz: 9-9-9-24
  156. Supported Module Timing at 533.3 MHz: 8-8-8-20
  157. Supported Module Timing at 400.0 MHz: 6-6-6-15
  158. Minimum Write Recovery Time (tWRmin): 15.000 ns
  159. Minimum Row Active to Row Active Delay (tRRDmin): 7.500 ns
  160. Minimum Active to Active/Refresh Time (tRCmin): 50.625 ns
  161. Minimum Refresh Recovery Time Delay (tRFCmin): 110.000 ns
  162. Minimum Internal Write to Read Command Delay (tWTRmin): 7.500 ns
  163. Minimum Internal Read to Precharge Command Delay (tRTPmin): 7.500 ns
  164. Minimum Four Activate Window Delay Time (tFAWmin): 37.500 ns
  165. [Features]
  166. On-die Thermal Sensor (ODTS) Readout: Not Supported
  167. Auto Self Refresh (ASR): Not Supported
  168. Extended Temperature Refresh Rate: Not Supported
  169. Extended Temperature Range: Supported
  170. Module Temperature Sensor: Not Supported
  171. Module Nominal Height: 30 - 31 mm
  172. Module Maximum Thickness (Front): 2 - 3 mm
  173. Module Maximum Thickness (Back): 2 - 3 mm
  174.  
  175. Sapphire Radeon HD 5670
  176. ATI/AMD Radeon HD 5670/5690/5730 ------------------------------------------
  177.  
  178. [Video chipset]
  179. Video Chipset: ATI/AMD Radeon HD 5670/5690/5730
  180. Video Chipset Codename: REDWOOD XT MVD
  181. Video Memory: 1024 MBytes of GDDR5 SDRAM
  182. [Video Card]
  183. Video Card: Sapphire Radeon HD 5670
  184. Video RAMDAC: Internal DAC(400MHz)
  185. [Performance]
  186. Serial Number: 2698265839255
  187. [Driver Information]
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