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- HWiNFO64 Version 4.20-1960
- Central Processor(s) ------------------------------------------------------
- [CPU Unit Count]
- Number Of Processor Packages (Physical): 1
- Number Of Processors Cores: 4
- Number Of Logical Processors: 4
- AMD Athlon II X4 645 ------------------------------------------------------
- [General Information]
- Processor Name: AMD Athlon II X4 645
- Original Processor Frequency: 3100.0 MHz
- Original Processor Frequency [MHz]: 3100
- CPU ID: 00100F53
- Extended CPU ID: 00100F53
- CPU Thermal Design Power (TDP): 94.5 W
- CPU Thermal Design Current (TDC): 75.6 A
- Number of CPU Cores: 4
- Number of Logical CPUs: 4
- [Operating Points]
- CPU HFM (Maximum): 3100.0 MHz = 15.50 x 200.0 MHz @ 1.3750 V
- CPU Current: 3113.3 MHz = 15.50 x 200.9 MHz @ 1.3750 V
- Northbridge Maximum: 2000.0 MHz = 10.00 x 200.0 MHz @ 1.3750 V
- Northbridge Current: 2000.0 MHz = 10.00 x 200.0 MHz @ 1.1750 V
- CPU Bus Type: Hyper-Transport v3.00
- Maximum Supported Hyper-Transport Link Clock: 2000 MHz
- Current Hyper-Transport Link Clock: 2000 MHz
- [Cache and TLB]
- L1 Cache: Instruction: 4 x 64 KBytes, Data: 4 x 64 KBytes
- L2 Cache: Integrated: 4 x 512 KBytes
- [Standard Feature Flags]
- [Extended Feature Flags]
- [Enhanced Features]
- [Memory Ranges]
- [MTRRs]
- Motherboard ---------------------------------------------------------------
- [Computer]
- [Motherboard]
- Motherboard Model: GIGABYTE GA-880GM-UD2H
- Motherboard Chipset: AMD RS880 + SB750/SB710
- Motherboard Slots: 2xPCI, 1xAGP, 1xPCI Express x1, 1xPCI Express x16
- PCI Express Version Supported: v2.0
- USB Version Supported: v2.0
- [BIOS]
- Super-IO/LPC Chip: ITE IT8720F
- Memory --------------------------------------------------------------------
- [General information]
- Total Memory Size: 4 GBytes
- Total Memory Size [MB]: 4096
- [Current Performance Settings]
- Maximum Supported Memory Clock: 666.7 MHz
- Current Memory Clock: 669.5 MHz
- Current Timing (tCAS-tRCD-tRP-tRAS): 9.0-9-9-24
- Memory Runs At: Single-Channel
- Command Rate: 2T
- Read to Read Delay (tRD_RD) Different Rank: 4T
- Write to Write Delay (tWR_WR) Different Rank: 4T
- Write to Read Delay (tWR_RD) Same Rank (tWTR): 5T
- Write to Precharge Delay (tWTP): 21T
- Write Recovery Time (tWR): 10T
- RAS# to RAS# Delay (tRRD): 5T
- Row Cycle Time (tRC): 34T
- Four Activate Window (tFAW): 24T
- Row: 0 - 2048 MB PC3-10600 DDR3 SDRAM Corsair VS2GB1333D4 -----------------
- [General Module Information]
- Module Number: 0
- Module Size: 2048 MBytes
- Memory Type: DDR3 SDRAM
- Module Type: Unbuffered DIMM (UDIMM)
- Memory Speed: 666.7 MHz (PC3-10600)
- Module Manufacturer: Corsair
- Module Part Number: VS2GB1333D4
- Module Revision: 0
- Module Serial Number: 0
- Module Manufacturing Date: Year: 2000, Week: 0
- Module Manufacturing Location: 1
- SDRAM Manufacturer: Unknown
- Error Check/Correction: None
- [Module characteristics]
- Row Address Bits: 15
- Column Address Bits: 10
- Number Of Banks: 8
- Module Density: 2048 Mb
- Number Of Ranks: 1
- Device Width: 8 bits
- Bus Width: 64 bits
- Module Nominal Voltage (VDD): 1.5 V
- [Module timing]
- Minimum SDRAM Cycle Time (tCKmin): 1.500 ns
- CAS# Latencies Supported: 6, 7, 8, 9
- Minimum CAS# Latency Time (tAAmin): 13.500 ns
- Minimum RAS# to CAS# Delay (tRCDmin): 13.500 ns
- Minimum Row Precharge Time (tRPmin): 13.500 ns
- Minimum Active to Precharge Time (tRASmin): 36.000 ns
- Supported Module Timing at 666.7 MHz: 9-9-9-24
- Supported Module Timing at 533.3 MHz: 8-8-8-20
- Supported Module Timing at 400.0 MHz: 6-6-6-15
- Minimum Write Recovery Time (tWRmin): 15.000 ns
- Minimum Row Active to Row Active Delay (tRRDmin): 7.500 ns
- Minimum Active to Active/Refresh Time (tRCmin): 50.625 ns
- Minimum Refresh Recovery Time Delay (tRFCmin): 160.000 ns
- Minimum Internal Write to Read Command Delay (tWTRmin): 7.500 ns
- Minimum Internal Read to Precharge Command Delay (tRTPmin): 7.500 ns
- Minimum Four Activate Window Delay Time (tFAWmin): 37.500 ns
- [Features]
- On-die Thermal Sensor (ODTS) Readout: Not Supported
- Auto Self Refresh (ASR): Not Supported
- Extended Temperature Refresh Rate: Not Supported
- Extended Temperature Range: Supported
- Module Temperature Sensor: Not Supported
- Module Nominal Height: 30 - 31 mm
- Module Maximum Thickness (Front): 2 - 3 mm
- Module Maximum Thickness (Back): 2 - 3 mm
- Row: 2 - 2048 MB PC3-10600 DDR3 SDRAM Corsair VS2GB1333D3 -----------------
- [General Module Information]
- Module Number: 2
- Module Size: 2048 MBytes
- Memory Type: DDR3 SDRAM
- Module Type: Unbuffered DIMM (UDIMM)
- Memory Speed: 666.7 MHz (PC3-10600)
- Module Manufacturer: Corsair
- Module Part Number: VS2GB1333D3
- Module Revision: 0
- Module Serial Number: 0
- Module Manufacturing Date: Year: 2000, Week: 0
- Module Manufacturing Location: 1
- SDRAM Manufacturer: Unknown
- Error Check/Correction: None
- [Module characteristics]
- Row Address Bits: 14
- Column Address Bits: 10
- Number Of Banks: 8
- Module Density: 1024 Mb
- Number Of Ranks: 2
- Device Width: 8 bits
- Bus Width: 64 bits
- Module Nominal Voltage (VDD): 1.5 V
- [Module timing]
- Minimum SDRAM Cycle Time (tCKmin): 1.500 ns
- CAS# Latencies Supported: 6, 7, 8, 9
- Minimum CAS# Latency Time (tAAmin): 13.500 ns
- Minimum RAS# to CAS# Delay (tRCDmin): 13.500 ns
- Minimum Row Precharge Time (tRPmin): 13.500 ns
- Minimum Active to Precharge Time (tRASmin): 36.000 ns
- Supported Module Timing at 666.7 MHz: 9-9-9-24
- Supported Module Timing at 533.3 MHz: 8-8-8-20
- Supported Module Timing at 400.0 MHz: 6-6-6-15
- Minimum Write Recovery Time (tWRmin): 15.000 ns
- Minimum Row Active to Row Active Delay (tRRDmin): 7.500 ns
- Minimum Active to Active/Refresh Time (tRCmin): 50.625 ns
- Minimum Refresh Recovery Time Delay (tRFCmin): 110.000 ns
- Minimum Internal Write to Read Command Delay (tWTRmin): 7.500 ns
- Minimum Internal Read to Precharge Command Delay (tRTPmin): 7.500 ns
- Minimum Four Activate Window Delay Time (tFAWmin): 37.500 ns
- [Features]
- On-die Thermal Sensor (ODTS) Readout: Not Supported
- Auto Self Refresh (ASR): Not Supported
- Extended Temperature Refresh Rate: Not Supported
- Extended Temperature Range: Supported
- Module Temperature Sensor: Not Supported
- Module Nominal Height: 30 - 31 mm
- Module Maximum Thickness (Front): 2 - 3 mm
- Module Maximum Thickness (Back): 2 - 3 mm
- Sapphire Radeon HD 5670
- ATI/AMD Radeon HD 5670/5690/5730 ------------------------------------------
- [Video chipset]
- Video Chipset: ATI/AMD Radeon HD 5670/5690/5730
- Video Chipset Codename: REDWOOD XT MVD
- Video Memory: 1024 MBytes of GDDR5 SDRAM
- [Video Card]
- Video Card: Sapphire Radeon HD 5670
- Video RAMDAC: Internal DAC(400MHz)
- [Performance]
- Serial Number: 2698265839255
- [Driver Information]
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